Abstract: A triblock polymer of formula B-A-B is provided. According to the formula, the symbol A represents a “central” block which is a statistical copolymer comprising units of a 1,3-diene and more than 50 mol % of ethylene units. The symbols B each represent an “end” block which is a polyethylene with a melting point of greater than 90° C. and a number-average molar mass of greater than or equal to 2000 g/mol and less than or equal to 10 000 g/mol. The polymer has improved rheological properties relative to a statistical copolymer based on ethylene and 1,3-diene of the same microstructure without changing its mechanical and dynamic or thermal properties.

Abstract: A diblock polymer composed of a first block and a second block is provided. The first block is a statistical copolymer comprising units of a 1,3-diene and more than 50 mol % of ethylene units. The second block is a polyethylene with a melting point above 90° C. and a number-average molar mass greater than or equal to 2000 g/mol and less than or equal to 10 000 g/mol. Such a diblock polymer has improved rheology compared to a statistical copolymer of the same microstructure and of the same macrostructure as the first block of the diblock polymer.

Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.

Abstract: The invention provides compositions and methods for inducing and enhancing order and nanostructures in organosilicon block copolymers compositions by including certain organic additives in such compositions that include one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor. Such block copolymer compositions may be used, for example, as a mask for lithographic patterning as is used, for example, during various stages of semiconductor device fabrication.

Abstract: Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor including hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound including, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.

Abstract: Junction-functionalized block copolymers can be used in forming nanostructures. A junction-functionalized block copolymer can include a first polymer block joined to a second polymer block by a junction, where the junction includes one or more electrostatically charged moieties. The block copolymer can include a moiety of formula (I): A-J-B??(I) where A is a first polymer block, B is a second polymer block, where the A block and the B block are chemically dissimilar, and J is a junction linking the A block to the B block, and including one or more electrostatically charged moieties.

Abstract: Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.

Abstract: The invention provides compositions and methods for inducing and enhancing order and nanostructures in organosilicon block copolymers compositions by including certain organic additives in such compositions that include one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor. Such block copolymer compositions may be used, for example, as a mask for lithographic patterning as is used, for example, during various stages of semiconductor device fabrication.

Abstract: The invention provides compositions and methods for inducing and enhancing order and nanostructures in organosilicon block copolymers compositions by including certain organic additives in such compositions that include one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor. Such block copolymer compositions may be used, for example, as a mask for lithographic patterning as is used, for example, during various stages of semiconductor device fabrication.

Abstract: Junction-functionalized block copolymers can be used in forming nanostructures. A junction-functionalized block copolymer can include a first polymer block joined to a second polymer block by a junction, where the junction includes one or more electrostatically charged moieties. The block copolymer can include a moiety of formula (I): A-J-B??(I) where A is a first polymer block, B is a second polymer block, where the A block and the B block are chemically dissimilar, and J is a junction linking the A block to the B block, and including one or more electrostatically charged moieties.

Abstract: The invention provides compositions and methods for inducing and enhancing order and nanostructures in organosilicon block copolymers compositions by including certain organic additives in such compositions that include one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor. Such block copolymer compositions may be used, for example, as a mask for lithographic patterning as is used, for example, during various stages of semiconductor device fabrication.

Abstract: Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound comprising, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.

Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.

Abstract: The present invention relates to a method for synthesizing a supramolecular material comprising: 1—the reaction of at least one carboxylic diacid, or ester or chloride of such a diacid, with, on the one hand, at least one modifier compound bearing both reactive functional groups capable of reacting with the carboxylic acid, ester or acid chloride functional groups and associative groups capable of associating with one another by hydrogen bonds, in a molar ratio of the reactive functional groups to the carboxylic acid, ester or acid chloride functional groups of between 0.10 and 0.50, and, on the other hand, at least one polyamine, said reactions being carried out successively or simultaneously, and 2—the reaction of the polyamide obtained at the end of step 1 with urea. The present invention also relates to the resulting material, and also to the uses thereof.

Abstract: Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.

Abstract: The present invention relates to a method for synthesizing a supramolecular material comprising: 1—the reaction of at least one carboxylic diacid, or ester or chloride of such a diacid, with, on the one hand, at least one modifier compound bearing both reactive functional groups capable of reacting with the carboxylic acid, ester or acid chloride functional groups and associative groups capable of associating with one another by hydrogen bonds, in a molar ratio of the reactive functional groups to the carboxylic acid, ester or acid chloride functional groups of between 0.10 and 0.50, and, on the other hand, at least one polyamine, said reactions being carried out successively or simultaneously, and 2—the reaction of the polyamide obtained at the end of step 1 with urea. The present invention also relates to the resulting material, and also to the uses thereof.