Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.

Abstract: Semi-automated (with manual feeding) and fully automated (with automated feeding) solutions for using a vision system to evaluate shield trim quality on shielded cables. The vision system uses a multiplicity of cameras and a corresponding multiplicity of mirrors in order to achieve a 360-degree view of the cable segment to be inspected. Cables to be inspected are positioned in a repeatable location based on the strip length of the cable (where the edge of the cable jacket is located relative to the end of the cable). The processing system receives a live image feed from the camera system and then uses color and dimensional analysis of the acquired images to determine whether the shield trim meets quality control specifications or not.

Abstract: Methods and apparatus to assemble cable mounts are disclosed. A disclosed example mount to be inserted into a formboard includes a spine, first and second opposing clamp surfaces on first and second ends, respectively, of the spine, and a pocket to receive a fastener, the fastener to be disposed between the first and second opposing clamp surfaces, the fastener to have a contractible engaging portion to be received by the formboard.

Abstract: Semi-automated (with manual feeding) and fully automated (with automated feeding) solutions for using a vision system to evaluate shield trim quality on shielded cables. The vision system uses a multiplicity of cameras and a corresponding multiplicity of mirrors in order to achieve a 360-degree view of the cable segment to be inspected. Cables to be inspected are positioned in a repeatable location based on the strip length of the cable (where the edge of the cable jacket is located relative to the end of the cable). The processing system receives a live image feed from the camera system and then uses color and dimensional analysis of the acquired images to determine whether the shield trim meets quality control specifications or not.

Abstract: An automated system for processing an end of a cable. The system includes: a cable delivery system; a cable processing module; a pallet supported by the cable delivery system; a drive wheel rotatably coupled to the pallet; a motor operatively coupled for driving rotation of the drive wheel; and an idler wheel rotatably coupled to the pallet and forming a nip with the drive wheel. The cable processing module includes cable processing equipment configured to perform an operation on an end of a cable and a computer system. The computer system is configured to: (a) cause the drive wheel to rotate in a cable pushing direction to cause a specified length of cable to be inserted into the cable processing equipment; (b) activate the cable processing equipment to perform an operation on the inserted end of the cable; and (c) cause the drive wheel to rotate in a cable pulling direction to cause the specified length of cable to be removed from the cable processing equipment.

Abstract: An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.

Abstract: A shield trim is performed by tearing bunched shield strands circumferentially along a circular edge. The apparatus includes a pair of aligned metal plates that have been drilled through multiple times such that holes of varying diameters pass may be passed through both plates. A cable gripper on the entry side of the device clamps the cable in place. A shield gripper on the rear side of the device closes over the exposed shielding of the cable, and the two plates are pushed together. The shield gripper travels with the rear plate, pushing the shield over the wires and causing the shield to bunch between the two plates. With the two plates pushed together, both grippers open and the cable is pulled free from the device. This pull forces a stress concentration on the shield strands as they are pulled and subsequently torn across the sharp edge of the hole, producing a uniformly trimmed shield.

Abstract: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.

Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

Abstract: A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: Methods and apparatus to assemble cable mounts are disclosed. A disclosed example mount to be inserted into a formboard includes a spine, first and second opposing clamp surfaces on first and second ends, respectively, of the spine, and a pocket to receive a fastener, the fastener to be disposed between the first and second opposing clamp surfaces, the fastener to have a contractible engaging portion to be received by the formboard.

Abstract: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.