Abstract: A mechanism for handling semiconductor wafers includes a feed section which comprises a vertically movable elevator able to hold a number of vertically spaced carriers. Each carrier has a film frame mounted thereon for supporting a wafer. A pulling mechanism pulls a selected carrier out of the elevator along a first axis and into a pick and place section. A transfer mechanism removes individual dies from the wafer and moves them to a flip station along a second axis oriented perpendicularly to the first axis. The transfer mechanism can move different distances along the second axis to be able to remove dies arranged in a row along the second axis. The flip station is driven by a single motor to both lower and invert the dies.