Patents by Inventor Damon B. Crockett
Damon B. Crockett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210162566Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: ApplicationFiled: February 10, 2021Publication date: June 3, 2021Inventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Patent number: 10946500Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: GrantFiled: October 4, 2017Date of Patent: March 16, 2021Assignee: US SYNTHETIC CORPORATIONInventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Patent number: 10350730Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.Type: GrantFiled: April 7, 2014Date of Patent: July 16, 2019Assignee: US SYNTHETIC CORPORATIONInventors: David P. Miess, Kenneth E. Bertagnolli, Damon B. Crockett, Arnold D. Cooper
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Patent number: 10252233Abstract: In an embodiment, a cell assembly for use in a high-pressure cubic press may include at least one can assembly containing a diamond volume. The at least one can assembly may include an end surface in proximity to the diamond volume. The cell assembly may include at least one heating element including a major surface generally opposing and positioned adjacent to the end surface of the at least one can assembly. The at least one heating element may be positioned and configured to heat the diamond volume. The cell assembly may include at least one pressure transmitting medium extending about the at least one can assembly, and a gasket medium that defines a receiving space configured to receive the at least one can assembly, the one or more heating elements, and the at least one pressure transmitting medium.Type: GrantFiled: April 6, 2017Date of Patent: April 9, 2019Assignee: US SYNTHETIC CORPORATIONInventors: Kenneth E. Bertagnolli, Michael A. Vail, Arnold D. Cooper, Paul Douglas Jones, Damon B. Crockett
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Patent number: 9999962Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: GrantFiled: May 4, 2015Date of Patent: June 19, 2018Assignee: US SYNTHETIC CORPORATIONInventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Publication number: 20180043508Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: ApplicationFiled: October 4, 2017Publication date: February 15, 2018Inventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Publication number: 20160230471Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.Type: ApplicationFiled: April 20, 2016Publication date: August 11, 2016Inventors: Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Publication number: 20160186805Abstract: Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.Type: ApplicationFiled: March 9, 2016Publication date: June 30, 2016Inventors: S. Barrett Peterson, Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Edward Christensen, Damon B. Crockett, Mohammad N. Sani
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Patent number: 9334694Abstract: Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.Type: GrantFiled: August 5, 2014Date of Patent: May 10, 2016Assignee: US SYNTHETIC CORPORATIONInventors: Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Patent number: 9297411Abstract: Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.Type: GrantFiled: March 28, 2012Date of Patent: March 29, 2016Assignee: US SYNTHETIC CORPORATIONInventors: S Barrett Peterson, Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Publication number: 20150239097Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: ApplicationFiled: May 4, 2015Publication date: August 27, 2015Inventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Patent number: 9062505Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: GrantFiled: June 22, 2011Date of Patent: June 23, 2015Assignee: US SYNTHETIC CORPORATIONInventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Patent number: 8950519Abstract: Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.Type: GrantFiled: September 16, 2011Date of Patent: February 10, 2015Assignee: US Synthetic CorporationInventors: Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Publication number: 20140367177Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.Type: ApplicationFiled: August 5, 2014Publication date: December 18, 2014Inventors: Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Publication number: 20140366456Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.Type: ApplicationFiled: June 22, 2011Publication date: December 18, 2014Applicant: US SYNTHETIC CORPORATIONInventors: Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett
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Publication number: 20140367176Abstract: Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.Type: ApplicationFiled: September 16, 2011Publication date: December 18, 2014Applicant: US SYNTHETIC CORPORATIONInventors: Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani
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Publication number: 20140215926Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.Type: ApplicationFiled: April 7, 2014Publication date: August 7, 2014Applicant: US SYNTHETIC CORPORATIONInventors: David P. Miess, Kenneth E. Bertagnolli, Damon B. Crockett, Arnold D. Cooper
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Patent number: 8727046Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.Type: GrantFiled: April 15, 2011Date of Patent: May 20, 2014Assignee: US Synthetic CorporationInventors: David P. Miess, Kenneth E. Bertagnolli, Damon B. Crockett, Arnold D. Cooper
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Publication number: 20130264125Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.Type: ApplicationFiled: June 4, 2013Publication date: October 10, 2013Inventors: David P. Miess, Kenneth E. Bertagnolli, Damon B. Crockett, Arnold D. Cooper
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Publication number: 20130156357Abstract: Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.Type: ApplicationFiled: March 28, 2012Publication date: June 20, 2013Applicant: US SYNTHETIC CORPORATIONInventors: S. Barrett Peterson, Jair J. Gonzalez, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess, Mark P. Chapman, Ronald W. Ward, Nicholas Christensen, Damon B. Crockett, Mohammad N. Sani