Abstract: A calibration object is transferred from a processing chamber to an aligner station by one or more robot arms. The calibration object has a first processing chamber orientation in the processing chamber and a second orientation at the aligner station. A first characteristic error value associated with a transfer path between the processing chamber and the aligner is determined based on the first processing chamber orientation and the second orientation of the calibration object at the aligner station. In response to detecting an object at the aligner station to be transferred to the processing chamber along the transfer path, the object is aligned by the aligner station to be placed in the processing chamber according to a target processing chamber orientation based on a target aligner orientation as adjusted by the first characteristic error value determined for the transfer path between the processing chamber and the aligner station.

Abstract: A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber. The calibration object is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock and placed at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation and an initial target orientation at the aligner station. A first characteristic error value associated with the processing chamber is determined based on the determined difference. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.

Abstract: A method for calibrating an aligner station of an electronics processing system is provided. A calibration is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber. The calibration object has a target orientation in the processing chamber. The calibration is placed, by the first robot art, in a load lock connected to the transfer chamber. The calibration is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock. The calibration object is placed, by the second robot arm, at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation at the aligner station and an initial target orientation at the aligner station. The initial target orientation at the aligner station is associated with the target orientation in the processing chamber.

Abstract: The present invention provides methods, apparatus, and systems for a wrist assembly including a housing having a cap and a bottom, at least one pivot at least partially enclosed in the housing and adapted to be coupled to a robot arm, and a belt coupled to the pivot and adapted to rotate the pivot about a bearing. The bottom of the housing is adapted to reflect heat away from the at least one pivot and the bearing.

Abstract: Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or pre-processing steps are performed on the substrate to provide data for processes performed on subsequent substrates. In one aspect of the invention, a system controller and one or more analysis devices are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

Abstract: Methods for automated calibration and diagnostics of a workpiece transfer system are provided. In one embodiment, a method for locating an end effector includes retrieving a workpiece located at a target location, passing the workpiece through a plurality of sensors, wherein at least one of the sensors changes state in response to a position of at least one of the end effector or workpiece, recording a metric of robot position associated with the sensor change of state, determining an error for an expected metric of the end effector position from the recorded robot position metric and correcting a taught location of the robot for the target position. In another embodiment, a process for monitoring a robotic transfer system is provided that includes detecting a first positional error in a robotic transfer system, and comparing the first positional error to a second positional error in the robotic transfer system.

Abstract: A wafer handler having a central body with a first end and a central axis of rotation is provided. A first end effector, adapted to support a first wafer, is rotatably coupled to the first end of the central body so as to define a first axis of rotation between the central body and the first end effector. Optionally, a second end effector adapted to support a second wafer is rotatably coupled to the second end of the central body so as to define a second axis of rotation between the central body and the second end effector. When the central body is rotated about the central axis of rotation in a first direction over a first angular distance, the first end effector simultaneously rotates about the first axis of rotation and the optional second end effector rotates about the second axis of rotation. Both end effectors are rotated over a second angular distance that is greater than the first angular distance. One or more of the end effectors may be pocketless.

Abstract: A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.

Abstract: A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.

Abstract: An apparatus for processing semiconductor wafers has an automatic robot for independently and simultaneously handling two wafers (W) at the same time on two separate transfer planes.