Patents by Inventor Dan Dai
Dan Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240099955Abstract: The present disclosure relates to a recombinant collagen fragment having a molecular weight of about 55 kDa, and compositions comprising the recombinant collagen fragment. Methods of producing the recombinant collagen fragment and methods of treatment using the recombinant collagen fragment are also provided.Type: ApplicationFiled: February 4, 2022Publication date: March 28, 2024Inventors: Yelena ZOLOTARSKY, Lixin DAI, Dan DUEPPEN
-
Patent number: 11584408Abstract: A system includes one or more processors that are configured to obtain a constraint on movement for a first vehicle system along a route. The constraint is based on movement of a separate second vehicle system that is concurrently traveling along the same route. The processor(s) are configured to determine a speed profile that designates speeds for the first vehicle system according to at least one of distance, location, or time based on the constraint such that the first vehicle system maintains a designated spacing from the second vehicle system along the route.Type: GrantFiled: April 29, 2020Date of Patent: February 21, 2023Assignee: TRANSPORTATION IP HOLDINGS, LLCInventors: Harry Kirk Mathews, Jr., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Patent number: 11499080Abstract: This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material.Type: GrantFiled: May 8, 2018Date of Patent: November 15, 2022Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING CHINESE ACADEMY OF SCIENCESInventors: Wen Dai, Zhengde Lin, Nan Jiang, Jinhong Yu, Dan Dai, Hao Hou
-
Patent number: 10967514Abstract: Mechanical condition monitoring of robots can be used to detect unexpected failure of robots. Data taken from a robot operation is processed and compared against a health baseline. Features extracted during the monitoring stage of robot operation are aligned with features extracted during the training stage in which the health baseline is established by projecting both onto a common subspace. A classifier which can include a distance assessment such as an L2-norm is used within the common subspace to assess the condition of the robot. Excursions of the distance assessment from a criteria indicate a failure or potential failure.Type: GrantFiled: August 22, 2018Date of Patent: April 6, 2021Assignee: ABB Schweiz AgInventors: Arash Mahyari, Nevroz Sen, Thomas Locher, Wenzhi Gao, Dan Dai, Said Zahrai
-
Publication number: 20210054253Abstract: This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material.Type: ApplicationFiled: May 8, 2018Publication date: February 25, 2021Inventors: Wen DAI, Zhengde LIN, Nan JIANG, Jinhong YU, Dan DAI, Hao HOU
-
Publication number: 20200255041Abstract: A system includes one or more processors that are configured to obtain a constraint on movement for a first vehicle system along a route. The constraint is based on movement of a separate second vehicle system that is concurrently traveling along the same route. The processor(s) are configured to determine a speed profile that designates speeds for the first vehicle system according to at least one of distance, location, or time based on the constraint such that the first vehicle system maintains a designated spacing from the second vehicle system along the route.Type: ApplicationFiled: April 29, 2020Publication date: August 13, 2020Inventors: Harry Kirk Mathews, JR., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Publication number: 20200216307Abstract: A method for manufacturing a dual-cavity structure and a dual-cavity structure, including: etching on a semiconductor substrate to form a first trench array, tops of the first trench array being separated from each other and bottoms thereof being communicated with each other to form a first cavity; growing a first epitaxial layer on the semiconductor substrate on which the first trench array is formed, to cover the first trench array by the first epitaxial layer; etching on the first epitaxial layer to form a second trench array; tops of the second trench array being separated from each other and bottoms thereof being communicated with each other to form a second cavity; growing a second epitaxial layer on the first epitaxial layer on which the second trench array is formed; and etching the first epitaxial layer and the second epitaxial layer to form a straight groove.Type: ApplicationFiled: July 3, 2018Publication date: July 9, 2020Inventors: Dan Dai, Changfeng Xia, Juanjuan Dong
-
Patent number: 10676115Abstract: A system includes one or more processors that are configured to obtain a constraint on movement for a first vehicle system along a route. The constraint is based on movement of a separate second vehicle system that is concurrently traveling along the same route. The processor(s) are configured to determine a speed profile that designates speeds for the first vehicle system according to at least one of distance, location, or time based on the constraint such that the first vehicle system maintains a designated spacing from the second vehicle system along the route.Type: GrantFiled: December 6, 2018Date of Patent: June 9, 2020Assignee: GE GLOBAL SOURCING LLCInventors: Harry Kirk Mathews, Jr., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Publication number: 20200061833Abstract: Mechanical condition monitoring of robots can be used to detect unexpected failure of robots. Data taken from a robot operation is processed and compared against a health baseline. Features extracted during the monitoring stage of robot operation are aligned with features extracted during the training stage in which the health baseline is established by projecting both onto a common subspace. A classifier which can include a distance assessment such as an L2-norm is used within the common subspace to assess the condition of the robot. Excursions of the distance assessment from a criteria indicate a failure or potential failure.Type: ApplicationFiled: August 22, 2018Publication date: February 27, 2020Inventors: Arash Mahyari, Nevroz Sen, Thomas Locher, Wenzhi Gao, Dan Dai, Said Zahrai
-
Publication number: 20190106133Abstract: A system includes an energy management system disposed onboard a vehicle system configured to travel on a route during a trip. The energy management system is configured to receive trip information that includes one or more constraints including at least one of speed, distance, or time restrictions for the vehicle system along the route. The energy management system is further configured to generate a trip plan for controlling movement of the vehicle system along the route during the trip. The trip plan is generated based on the one or more constraints. The trip plan has a plan speed profile that designates speeds for the vehicle system according to at least one of distance or time during the trip. The energy management system is further configured to control movement of the vehicle system during the trip according to the plan speed profile of the trip plan.Type: ApplicationFiled: December 6, 2018Publication date: April 11, 2019Inventors: Harry Kirk Mathews, JR., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Patent number: 10183684Abstract: A system includes an energy management system disposed onboard a vehicle system configured to travel on a route during a trip. The energy management system is configured to receive trip information from a second vehicle system that includes one or more constraints including at least one of speed, distance, or time restrictions for the vehicle system along the route. The energy management system is further configured to generate a trip plan for controlling movement of the vehicle system along the route during the trip. The trip plan is generated based on the one or more constraints. The trip plan has a plan speed profile that designates speeds for the vehicle system according to at least one of distance or time during the trip. The energy management system is further configured to control movement of the vehicle system during the trip according to the plan speed profile of the trip plan.Type: GrantFiled: March 31, 2016Date of Patent: January 22, 2019Assignee: General Electric CompanyInventors: Harry Kirk Mathews, Jr., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Patent number: 10137912Abstract: System having one or more processors that are configured to (a) generate, as a vehicle system moves along a route, a plurality of different trial plans for an upcoming segment of the route. The trial plans include potential operational settings of the vehicle system along the route. The one or more processors that are configured to (b) select one of the trial plans as a selected plan or generate the selected plan based on one or more of the trial plans. The selected plan is configured to improve one or more system-handling metrics as the vehicle system moves along the upcoming segment of the route. The one or more processors are configured to (c) communicate instructions to change or not change at least one of the operational settings of the vehicle system based on the selected plan.Type: GrantFiled: February 22, 2017Date of Patent: November 27, 2018Assignee: GENERAL ELECTRIC COMPANYInventors: Gabriel de Albuquerque Gleizer, Carlos Gonzaga, Lucas Vargas, Anup Menon, Dan Dai, Harry Kirk Matthews, Jr.
-
Patent number: 10077188Abstract: A method of manufacturing a MEMS chip includes: providing a silicon substrate layer, the silicon substrate layer comprising a front surface configured to perform a MEMS process and a rear surface opposite to the front surface; growing a first oxidation layer mainly made of SiO2 on the rear surface of the silicon substrate layer by performing a thermal oxidation process; and depositing a first thin film layer mainly made of silicon nitride on the first oxidation layer by performing a low pressure chemical vapor deposition process.Type: GrantFiled: January 13, 2017Date of Patent: September 18, 2018Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.Inventors: Dan Dai, Xinwei Zhang, Guoping Zhou, Changfeng Xia
-
Publication number: 20180216017Abstract: According to some embodiments, data associated with the operation of a desalter vessel (150), adapted to receive a raw crude input and a water input and facilitate creation of a desalted crude output and a salt water output, may be stored in a computer storage device (630). A computer processor (610) may determine at least one parameter associated with the data in the computer store. The computer processor (610) may then automatically calculate, based on the determined parameter and a physics-based dynamic desalter model (400), an adjustment value for a second parameter associated with operation of the desalter vessel. Using the automatically calculated adjustment value, the computer processor (610) may automatically generate and transmit an indication of the adjustment value so as to improve operation of the desalter vessel (150).Type: ApplicationFiled: August 1, 2016Publication date: August 2, 2018Inventors: Aditya KUMAR, Michael Alan DION, Nimeshkumar Kantilal PATEL, Conrad Keny TERAN, Dan DAI, Randall Charles MCFARLANE, Sree Rama Raju VETUKURI, Vijaysai PRASAD
-
Publication number: 20180118237Abstract: System having one or more processors that are configured to (a) generate, as a vehicle system moves along a route, a plurality of different trial plans for an upcoming segment of the route. The trial plans include potential operational settings of the vehicle system along the route. The one or more processors that are configured to (b) select one of the trial plans as a selected plan or generate the selected plan based on one or more of the trial plans. The selected plan is configured to improve one or more system-handling metrics as the vehicle system moves along the upcoming segment of the route. The one or more processors are configured to (c) communicate instructions to change or not change at least one of the operational settings of the vehicle system based on the selected plan.Type: ApplicationFiled: February 22, 2017Publication date: May 3, 2018Inventors: Gabriel de Albuquerque Gleizer, Carlos Gonzaga, Lucas Vargas, Anup Menon, Dan Dai, Harry Kirk Matthews, Jr.
-
Patent number: 9849807Abstract: A vehicle control system includes one or more processors configured to assign plural vehicles to different groups in one or more vehicle systems for travel along one or more routes. The one or more processors also are configured to determine trip plans for the different groups. The trip plans designate different operational settings of the vehicles in the different groups at different locations along one or more routes during movement of the one or more vehicle systems along the one or more routes. The one or more processors also are configured to modify one or more of the groups to which the vehicles are assigned or the operational settings for the vehicles in one or more of the vehicle systems based on a movement parameter of one or more of the vehicle systems. The trip plans for the different groups of the vehicles are interdependent upon each other.Type: GrantFiled: August 26, 2016Date of Patent: December 26, 2017Assignee: General Electric CompanyInventors: Harry Kirk Mathews, Jr., Dan Dai, James Brooks
-
Publication number: 20170282942Abstract: A system includes an energy management system disposed onboard a vehicle system configured to travel on a route during a trip. The energy management system is configured to receive trip information that includes one or more constraints including at least one of speed, distance, or time restrictions for the vehicle system along the route. The energy management system is further configured to generate a trip plan for controlling movement of the vehicle system along the route during the trip. The trip plan is generated based on the one or more constraints. The trip plan has a plan speed profile that designates speeds for the vehicle system according to at least one of distance or time during the trip. The energy management system is further configured to control movement of the vehicle system during the trip according to the plan speed profile of the trip plan.Type: ApplicationFiled: March 31, 2016Publication date: October 5, 2017Inventors: Harry Kirk Mathews, JR., Brian Nedward Meyer, James D. Brooks, Joseph Daniel Wakeman, Dan Dai, Anup Menon
-
Patent number: 9676403Abstract: A vehicle control system and method determine one or more designated speeds of a trip plan for a trip of a vehicle system along a route. The trip plan can designate the one or more designated speeds as a function of one or more of time or distance along the route for the trip. Geometry of the route that the vehicle system will travel along during the trip is determined, as well as one or more prospective forces that will be exerted on the vehicle system during movement of the vehicle system along the route for the trip based at least in part on the geometry of the route. The trip plan is revised to reduce at least one of the prospective forces by reducing at least one of the designated speeds of the trip plan based on the one or more prospective forces that are determined.Type: GrantFiled: April 29, 2015Date of Patent: June 13, 2017Assignee: General Electric CompanyInventors: James Brooks, Harry Kirk Mathews, Jr., Dan Dai, Ramu Sharat Chandra, Gabriel De Albuquerque Gleizer, Bruno Paes Leao, Carlos Gonzaga
-
Publication number: 20170121175Abstract: A method of manufacturing a MEMS chip includes: providing a silicon substrate layer, the silicon substrate layer comprising a front surface configured to perform a MEMS process and a rear surface opposite to the front surface; growing a first oxidation layer mainly made of SiO2 on the rear surface of the silicon substrate layer by performing a thermal oxidation process; and depositing a first thin film layer mainly made of silicon nitride on the first oxidation layer by performing a low pressure chemical vapor deposition process.Type: ApplicationFiled: January 13, 2017Publication date: May 4, 2017Inventors: Dan DAI, Xinwei ZHANG, Guoping ZHOU, Changfeng XIA
-
Patent number: 9580301Abstract: A MEMS chip (100) includes a silicon substrate layer (110), a first oxidation layer (120) and a first thin film layer (130). The silicon substrate layer includes a front surface (112) for a MEMS process and a rear surface (114), both the front surface and the rear surface being polished surfaces. The first oxidation layer is mainly made of silicon dioxide and is formed on the rear surface of the silicon substrate layer. The first thin film layer is mainly made of silicon nitride and is formed on the surface of the first oxidation layer. In the above MEMS chip, by sequentially laminating a first oxidation layer and a first thin film layer on the rear surface of a silicon substrate layer, the rear surface is effectively protected to prevent the scratch damage in the course of a MEMS process. A manufacturing method for the MEMS chip is also provided.Type: GrantFiled: June 29, 2013Date of Patent: February 28, 2017Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.Inventors: Dan Dai, Xinwei Zhang, Guoping Zhou, Changfeng Xia