Patents by Inventor Dan V. Heap

Dan V. Heap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Paste-bond clevis joint
    Patent number: 7198692
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: April 3, 2007
    Assignee: Lockheed Martin Corporation
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson
  • Paste-bond clevis joint
    Patent number: 6863767
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: March 8, 2005
    Assignee: Lockheed Martin Corporation
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson
  • Paste-bond clevis joint
    Publication number: 20030037867
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Application
    Filed: August 23, 2001
    Publication date: February 27, 2003
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson