Abstract: A multi-zonal analysis processor-implemented system is provided for analyzing physical behavior of a multi-zonal physical object. Candidate multi-zonal engineering models, solution methods, and parameters associated with the engineering models and solution methods are selected for use in analyzing different zones of the physical object.

Abstract: A scalable periphery tunable matching power amplifier is presented. Varying power levels can be accommodated by selectively activating or deactivating unit cells of which the scalable periphery tunable matching power amplifier is comprised. Tunable matching allows individual unit cells to see a constant output impedance, reducing need for transforming a low impedance up to a system impedance and attendant power loss. The scalable periphery tunable matching power amplifier can also be tuned for different operating conditions such as different frequencies of operation or different modes.

Abstract: Various envelope tracking amplifiers are presented that can be switched between an ET (envelope tracking) mode and a non-ET mode. Switches and/or tunable components are utilized in constructing the envelope tracking amplifiers that can be switched between the ET mode and the non-ET mode.

Abstract: A plug for ease of alignment of a temperature probe or sensor inside a duct of a transformer winding is provided. The plug is shaped for secure placement into a duct or passage of a transformer winding without requiring any adhering material. The insertion of the plug into the duct or passage brings the temperature probe into contact with the desired point along the transformer winding being thermally monitored.

Abstract: Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

Abstract: A power tool includes a motor housing having a motor configured to rotate an output shaft about a drive axis and a gear housing defining a gear compartment. A pinion gear is supported by the gear housing that is coupled to the output shaft for rotation about the drive axis. A bevel gear is supported by the gear housing for rotation about a bevel axis perpendicular to the drive axis, the bevel gear being meshingly engaged with the pinion gear. A crank pin extends from the bevel gear at a position offset from the bevel axis. An articulating housing is pivotably supported by the gear housing for pivotal movement about the bevel axis. A plunger member is supported by the articulating housing for reciprocating movement along a reciprocating axis. The plunger member includes a yoke end portion coupled to the crank pin. The reciprocating axis and the drive axis reside in the same plane throughout pivotal movement of the articulating housing with respect to the gear housing.

Abstract: Methods and system for using a multifunctional filter to minimize insertion loss in a multimode communications system are described. Specifically described is a multifunctional filter that is configurable to operate in a bandpass mode when a first type of signal is propagated through the multifunctional filter, and to operate in a lowpass mode when a second type of signal is propagated through the multifunctional filter. The multifunctional filter presents a lower insertion loss to the second type of signal when operating in the lowpass mode than in the bandpass mode.

Abstract: A method of fabricating a metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more voids, passing through the voids a high pressure fluid comprising a functional material carried in a carrier fluid, and causing the functional material to deposit or otherwise integrate into the engineered microstructured material to form the metamaterial. Many microstructured materials and functional materials can be used, together with various techniques for controlling the location of the integration of the functional material within the microstructured material, so that a wide range of different metamaterials can be produced.

Abstract: A stacked pre-driver stage and a power amplifier including the stacked pre-driver stage are described. The stacked pre-driver stage comprises stacked pre-drivers arranged in series between a supply voltage and a reference voltage. Each pre-driver includes a pre-driving amplifier, together with MOS transistors. Each pre-driver is subject, in operation, to a voltage difference which is inferior to a maximum allowed use voltage of the MOS transistors with a largely reduced voltage drop across the regulator included in the power amplifier.

Abstract: A stacked pre-driver stage and a power amplifier including the stacked pre-driver stage are described. The stacked pre-driver stage comprises stacked pre-drivers arranged in series between a supply voltage and a reference voltage. Each pre-driver includes a pre-driving amplifier, together with MOS transistors. Each pre-driver is subject, in operation, to a voltage difference which is inferior to a maximum allowed use voltage of the MOS transistors with a largely reduced voltage drop across the regulator included in the power amplifier.

Abstract: A hand truck assembly includes a frame including an upper portion and a lower portion. The assembly further includes a handle attached to the upper portion of the frame. The assembly also includes a pair of wheels attached to the lower portion of the frame. In addition, the assembly includes a fixed work support member attached in fixed relation to the lower portion of the frame. The assembly further includes a movable work support member attached to the lower portion of the frame, the movable work support member being moveable between (i) a first position in which a free end portion of the movable work support member rests on the fixed work support member, and (ii) a second position in which the free end portion of the movable work support member is spaced apart from the fixed work support member. The assembly also includes a post attached in fixed relation to the free end portion of the movable work support member. The assembly additionally includes a power tool such as a hammer jack that defines a cavity.

Abstract: A tool support structure with an adjustable work support assembly comprises a base and a horizontal support provided on the top of the base. A work support assembly is provided on the horizontal support and is linearly slideable in a vertical direction in relation to the horizontal support. The work support assembly includes a first component and a second component. The first component is configured to be fixed in one of a plurality of first vertical positions with respect to the horizontal support. The second component is also provided on the horizontal support and is linearly slideable in a vertical direction in relation to the first component. The second component is configured to be fixed in one of a plurality of second vertical positions with respect to the first component.

Abstract: A method of fabricating a semiconductor metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more elongate, high aspect ratio voids, passing through the voids a high pressure fluid comprising a semiconductor material carried in a carrier fluid, and causing the semiconductor material to deposit onto the surface of the one or more voids of the engineered microstructured material to form the metamaterial. Many microstructured materials and semiconductor materials can be used, together with various techniques for controlling the location, spatial extent, and thickness of the deposition of the semiconductor within the microstructured material, so that a wide range of different metamaterials can be produced.

Abstract: A tool support structure with an adjustable work support assembly comprises a base and a horizontal support provided on the top of the base. A work support assembly is provided on the horizontal support and is linearly slideable in a vertical direction in relation to the horizontal support. The work support assembly includes a first component and a second component. The first component is configured to be fixed in one of a plurality of first vertical positions with respect to the horizontal support. The second component is also provided on the horizontal support and is linearly slideable in a vertical direction in relation to the first component. The second component is configured to be fixed in one of a plurality of second vertical positions with respect to the first component.

Abstract: A hand truck assembly includes a frame including an upper portion and a lower portion. The assembly further includes a handle attached to the upper portion of the frame. The assembly also includes a pair of wheels attached to the lower portion of the frame. In addition, the assembly includes a fixed work support member attached in fixed relation to the lower portion of the frame. The assembly further includes a movable work support member attached to the lower portion of the frame, the movable work support member being moveable between (i) a first position in which a free end portion of the movable work support member rests on the fixed work support member, and (ii) a second position in which the free end portion of the movable work support member is spaced apart from the fixed work support member. The assembly also includes a post attached in fixed relation to the free end portion of the movable work support member. The assembly additionally includes a power tool such as a hammer jack that defines a cavity.

Abstract: A tool mount assembly adapted to be attached to a support structure includes a body and a clamping mechanism configured to secure the body to the support structure. The assembly further includes a first member defining a first internally threaded passage, the first member being movable in relation to the body along a linear path of movement. The assembly also includes a second member defining a second internally threaded passage, the second member being pivotably secured to the body. The body has a first slot defined therein, and the first internally threaded passage is continuously aligned with the first slot during movement of the first member in the linear path of movement. In addition, the body has a second slot defined therein, and the second internally threaded passage is continuously aligned with the second slot during movement of the second member in an arcuate path of movement.

Abstract: The disclosure pertains to a method of constructing structures and the resulting structures with SEP technology but with additional building components that create very strong buildings, including the ability to withstand high winds. The disclosure includes the option of constructing vertical concrete columns and horizontal concrete beams within the joined panel walls. This results in combining structural insulated panel technology with insulated concrete form technology. The disclosure also teaches use of compression fasteners that extend through both layers of the panel skin to achieve a mechanical attachment of the panel skins and not relying totally on the adhesive bond found on the typical SIP thus creating a “true” box beam effect of the panel itself. The fasteners have large chambered heads. These fasteners can be used at the junction of abutting panels. The panels are block lap cut and the fastener extends through both block extensions.

Abstract: A method of fabricating a semiconductor metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more elongate, high aspect ratio voids, passing through the voids a high pressure fluid comprising a semiconductor material carried in a carrier fluid, and causing the semiconductor material to deposit onto the surface of the one or more voids of the engineered microstructured material to form the metamaterial. Many microstructured materials and semiconductor materials can be used, together with various techniques for controlling the location, spatial extent, and thickness of the deposition of the semiconductor within the microstructured material, so that a wide range of different metamaterials can be produced.