Abstract: An apparatus for measuring patient data includes a frame having a plurality of electrode hubs. Each hub can include one or more electrode members. The frame can be configured to receive a head of a patient. Each of the electrode hubs can have a single electrode member or a plurality of electrode members that extend from or are connected to an outer member for contacting a scalp of the head of the patient. The outer member can have at least one circuit configured to transmit data received by at least one of the electrode members to a measurement device via a wireless communication connection (e.g. Bluetooth, near field communication, etc.) or a wired communication connection.

Abstract: An apparatus for measuring patient data includes a frame having a plurality of electrode hubs. Each hub can include one or more electrode members. The frame can be configured to receive a head of a patient. Each of the electrode hubs can have a single electrode member or a plurality of electrode members that extend from or are connected to an outer member for contacting a scalp of the head of the patient. The outer member can have at least one circuit configured to transmit data received by at least one of the electrode members to a measurement device via a wireless communication connection (e.g. Bluetooth, near field communication, etc.) or a wired communication connection.

Abstract: An apparatus for measuring patient data includes a frame having a plurality of electrode hubs. Each hub can include one or more electrode members. The frame can be configured to receive a head of a patient. Each of the electrode hubs can have a single electrode member or a plurality of electrode members that extend from or are connected to an outer member for contacting a scalp of the head of the patient. The outer member can have at least one circuit configured to transmit data received by at least one of the electrode members to a measurement device via a wireless communication connection (e.g. Bluetooth, near field communication, etc.) or a wired communication connection.

Abstract: Provided are a system and method for a secure lock box with near proximity awareness. The system includes a lock box housing defining at least one enclosable space for the receipt of a package, the lock box housing having a sealable aperture for accessing the enclosable space and an electronic lock structured and arranged to seal the aperture and enclose the space. The lock box housing further encloses a processor, a near proximity device structured and arranged to actively detect a Package Attribute from a package proximate to the lock box housing, a network component coupled to the processor, and non-volatile memory coupled to the processor having executable instructions to direct the operations of the near proximity device and the electronic lock.

Abstract: A neurological condition detection unit can include a computer device that is connected to at least two leads that are connectable to a patient for evoking a response from that patient via an electrical current passed through the leads (e.g. a shock) and at plurality of sensors connected to the computer device to sense how the left side and right side of the patient's brain reacts to the evoked event (e.g. the shock). The stroke detection device and/or neurological condition detection unit can be configured to output a warning when one side of the patient's brain is determined to react differently than the opposite side of the patient's brain by at least a pre-selected threshold value. The warning can include an identification of a nearby care facility that may be best suited for providing care to a patient determined to have a neurological condition (e.g. a stroke).

Abstract: According to some embodiments, a SODIMM memory connector comprises a first socket to electrically couple a first SODIMM, and a second socket to electrically couple a second SODIMM, where the first socket is disposed vertically adjacent to the second socket.

Abstract: According to some embodiments, a connector to receive a memory module includes a first row of a first plurality of interconnect ends, a second row of a second plurality of interconnect ends adjacent to the first row, and a third row of a third plurality of interconnect ends adjacent to the second row. An interconnect end of the first plurality of interconnect ends, an interconnect end of the second plurality of interconnect ends, and an interconnect end of the third plurality of interconnect ends may be substantially aligned.

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract: A apparatus is described herein for configuring Input/Output (I/O) conductors on an integrated circuit (IC) or in a socket. At least a portion of the I/O conductors for an IC and/or contacts/receptacles of a socket are configured in a repeatable 2×4 rectangular T pattern. The rectangular T pattern includes a first line of four conductors, which include two ground conductors and a first differential pair of conductors, and a second line of four conductors, which include a second and a third pair of differential conductors. The I/O conductors on the IC may be pads/lands in an land-grid-array (LGA) style socket, pins in a pin-grid-array (PGA) style socket, or other conductor in another style of socket, while the socket includes corresponding contacts, receptacles, etc.

Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Abstract: A apparatus is described herein for configuring Input/Output (I/O) conductors on an integrated circuit (IC) or in a socket. At least a portion of the I/O conductors for an IC and/or contacts/receptacles of a socket are configured in a repeatable 2×4 rectangular T pattern. The rectangular T pattern includes a first line of four conductors, which include two ground conductors and a first differential pair of conductors, and a second line of four conductors, which include a second and a third pair of differential conductors. The I/O conductors on the IC may be pads/lands in an land-grid-array (EGA) style socket, pins in a pin-grid-array (PGA) style socket, or other conductor in another style of socket, while the socket includes corresponding contacts, receptacles, etc.

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract: According to some embodiments, a connector to receive a memory module includes a first row of a first plurality of interconnect ends, a second row of a second plurality of interconnect ends adjacent to the first row, and a third row of a third plurality of interconnect ends adjacent to the second row. An interconnect end of the first plurality of interconnect ends, an interconnect end of the second plurality of interconnect ends, and an interconnect end of the third plurality of interconnect ends may be substantially aligned.

Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.