Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.