Patents by Inventor Dana J. Fraser

Dana J. Fraser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6899140
    Abstract: A flexible pipe and a method of manufacturing same according to which a tubular sheath is provided that defines a longitudinal passage for receiving a conveyed fluid, a tape is formed by a plurality of metal fibers supported by a strip of flexible material to form a tape, and the tape is wound around the sheath.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: May 31, 2005
    Assignee: Wellstream International Limited
    Inventors: Dana J. Fraser, Colin Soens
  • Patent number: 6889715
    Abstract: A flexible pipe in which a layer of wound tape extends adjacent a surface of a tubular member to limit or prevent molecular migration through the tubular member.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 10, 2005
    Assignee: Wellstream International Limited
    Inventors: Dana J. Fraser, Charles Basil Firth
  • Patent number: 6827375
    Abstract: An end fitting for tubular member and a method of applying an end fitting to a tubular member, according to which an end portion of the tubular member is placed in an annular space defined between an outer ferrule and a tubular insert having a tapered inner wall and a radially outwardly-directed force is applied to the insert to force it into engagement with the tubular member.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: December 7, 2004
    Assignee: Wellstream International Limited
    Inventor: Dana J. Fraser
  • Patent number: 6769454
    Abstract: A flexible pipe formed by multiple layers of different materials, and one or more vent passages are provided in one of the layers for venting any gases permeating through the pipe.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: August 3, 2004
    Assignee: Wellstream International Limited
    Inventors: Dana J. Fraser, Mark D. Kalman
  • Publication number: 20040099324
    Abstract: A flexible pipe in which a layer of wound tape extends adjacent a surface of a tubular member to limit or prevent molecular migration through the tubular member.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Applicant: Wellstream, Inc.
    Inventors: Dana J. Fraser, Charles Basil Firth
  • Publication number: 20040089970
    Abstract: A system and method for treating pipes according to which the flexibility of the pipe is increased or maintained, or at least any decreases in the flexibility of the pipe is minimized, in relatively low temperature environments.
    Type: Application
    Filed: June 12, 2003
    Publication date: May 13, 2004
    Applicant: Wellstream International Limited
    Inventors: Dana J. Fraser, Cobie W. Loper
  • Patent number: 6705351
    Abstract: A flexible method that includes a tubular member defining a longitudinal passage adapted to contain a conveyed fluid, and a plurality of layers of flexible material helically wrapped around the tubular member.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: March 16, 2004
    Assignee: Wellstream International Limited
    Inventor: Dana J. Fraser
  • Publication number: 20040025953
    Abstract: A flexible pipe and a method of manufacturing same according to which a tubular sheath is provided that defines a longitudinal passage for receiving a conveyed fluid, a tape is formed by a plurality of metal fibers supported by a strip of flexible material to form a tape, and the tape is wound around the sheath.
    Type: Application
    Filed: August 12, 2002
    Publication date: February 12, 2004
    Applicant: Wellstream, Inc.
    Inventors: Dana J. Fraser, Colin Soens
  • Publication number: 20030183293
    Abstract: A flexible method that includes a tubular member defining a longitudinal passage adapted to contain a conveyed fluid, and a plurality of layers of flexible material helically wrapped around the tubular member.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 2, 2003
    Applicant: Wellstream, Inc.
    Inventor: Dana J. Fraser
  • Publication number: 20030111839
    Abstract: An end fitting for tubular member and a method of applying an end fitting to a tubular member, according to which an end portion of the tubular member is placed in an annular space defined between an outer ferrule and a tubular insert having a tapered inner wall and a radially outwardly-directed force is applied to the insert to force it into engagement with the tubular member.
    Type: Application
    Filed: October 1, 2002
    Publication date: June 19, 2003
    Applicant: Wellstream, Inc.
    Inventor: Dana J. Fraser
  • Publication number: 20030056845
    Abstract: A flexible pipe formed by multiple layers of different materials, and one or more vent passages are provided in one of the layers for venting any gases permeating through the pipe.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 27, 2003
    Applicant: Wellstream, Inc.
    Inventors: Dana J. Fraser, Mark D. Kalman
  • Patent number: 6446672
    Abstract: A flexible pipe formed by multiple layers of different materials, one of which has a vent passage.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: September 10, 2002
    Assignee: Wellstream, Inc.
    Inventors: Mark D. Kalman, Dana J. Fraser
  • Patent number: 6363974
    Abstract: A flexible pipe and a method of manufacturing same according to which the pipe is formed by multiple layers of different materials and suitable for use in subsea and land-based applications.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: April 2, 2002
    Assignee: Wellstream, Inc.
    Inventors: Ramon A. Perez, Dana J. Fraser, Mark D. Kalman
  • Patent number: 4680613
    Abstract: A low inductive impedance dual in-line package for an integrated circuit die incorporates a lead frame formed with a central opening without a die attach paddle. A ground plate forms the die attach plane spaced from and parallel with the lead frame. A dielectric layer is formed between the lead frame and ground plate. The lead frame is formed with a ground lead finger electrically coupled in parallel with the ground plate thereby providing a ground path through the ground plate with planar configuration to minimize inductive impedance to ground current and to minimize cross coupling between the electrically active lead fingers of the lead frame. In the preferred embodiment, the lead frame and ground plate are initially supported in a spaced parallel plane relationship by complementary spacing tab elements. During encapsulation, the encapsulation molding compound is introduced between the lead frame and ground plate to form the dielectric layer.
    Type: Grant
    Filed: December 1, 1983
    Date of Patent: July 14, 1987
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Wilbert E. Daniels, Dana J. Fraser