Patents by Inventor Dana L. Rose

Dana L. Rose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7223027
    Abstract: An optical communications adapter module is provided which includes a casing of a XENPAK-sized module and an optical communications board assembly positioned within the casing. The module also includes a first optical connector coupled to a second optical connector by fiber optics capable of communicating data between the first optical connector and the second optical connector where the first optical connector is coupled to a data transmission connector of the optical communications board assembly and the second optical connector is positioned at a face plate of the casing. The module also includes a third optical connector coupled to a fourth optical connector through fiber optics capable of transmitting data where the third optical connector is coupled to a data reception connector of the optical communications board assembly and the fourth optical connector is positioned at the face plate of the casing.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: May 29, 2007
    Assignee: Intel Corporation
    Inventors: Thomas B. Mader, Robert F. Buchheit, legal representative, Dana L. Rose, Daehwan D. Kim, Joshua T. Oen, Steve J. Buchheit, deceased
  • Patent number: 7008122
    Abstract: An optical communications adapter module is provided which includes a XENPAK-sized casing and an XFP board assembly having an optical transmission connector and an optical reception connector where the XFP board assembly is positioned within the casing so the optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the casing. The module further includes a conversion board that is coupled to the XFP board where the conversion board is capable of communicating data between the XFP board assembly and a client computing device.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: March 7, 2006
    Assignee: Intel Corporation
    Inventors: Thomas B. Mader, Dana L. Rose, Daehwan D. Kim
  • Publication number: 20040225951
    Abstract: A bit error rate test system for testing multi-source agreement (MSA) compliant transceivers is disclosed. The bit error rate test system is fabricated on a printed circuit board that includes an integral MSA compliant connector. An MSA compatible transceiver may be directly connected to the test system via the MSA compliant connecter, thereby eliminating the need for interposing cables, wires and/or additional interface boards.
    Type: Application
    Filed: December 20, 2001
    Publication date: November 11, 2004
    Inventors: Dana L. Rose, Tom B. Mader, Robert J. DeBoo