Patents by Inventor Dandy Navarro Jaducana

Dandy Navarro Jaducana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof
    Publication number: 20140133155
    Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.
    Type: Application
    Filed: January 16, 2014
    Publication date: May 15, 2014
    Applicant: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner MOERSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay
  • Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
    Patent number: 8669580
    Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: March 11, 2014
    Assignee: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner Morsheim, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay
  • Power Semiconductor Package
    Publication number: 20130001758
    Abstract: The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its bottom surface. The top lead frame is coupled to the bottom lead frame by an isolation layer, wherein the isolation layer is a thermal conductive, but electrical isolative, material. The power semiconductor package further comprises a power semiconductor device coupled to the top lead frame of the dual lead frame assembly and an encapsulation member encapsulating the dual lead frame assembly and the power semiconductor device, while exposing the first heat sink pad at the bottom surface of the bottom lead frame.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 3, 2013
    Applicant: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner MOERSHEIM, Fernando Villon CAPINIG, Dandy Navarro JADUCANA, Anthony Augusto Malon GALAY
  • Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof
    Publication number: 20120161632
    Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.
    Type: Application
    Filed: November 4, 2011
    Publication date: June 28, 2012
    Applicant: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner MORSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay