Abstract: A method and an apparatus for forming a crimped joint in an electrical wire terminal. The apparatus forms a crimped joint and substantially simultaneously bends and/or twists the terminal and electrical wire about their respective longitudinal axes, effective to reduce electrical contact resistance within the formed joint.

Abstract: There is disclosed herein a solder preform for use on printed circuit boards to provide reinforced solder joints thereon. The preform 70 comprises a solder body 72 made of solder, and a thin metallic member 30 attached to the solder body 72. The member 30 may be a metallic screen or foil having holes or perforations 32 therethrough, or may be a non-perforated metallic foil. A method for producing such reinforced solder joints is also disclosed.

Abstract: A printed circuit board 50 with reinforced solder joints and having a substrate 11 having mounting pads 14 arranged thereon and a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14. A solder joint 10 connects each termination 12 with its respective mounting pad 14, and a thin metallic member 30 is disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. Metallic member 30 is space from both the mounting pad ant the termination and is the same size as the mounting pad or smaller.

Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.