Patents by Inventor Daniel A. Tempas

Daniel A. Tempas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Continuously insulated wall assembly
    Patent number: 8397465
    Abstract: Construct a wall assembly by: (a) providing a support structure with spaced apart structural members; (b) affixing a thermally insulating layer of polymeric foam boards to the structural members, the foam boards achieving a Class A rating according to ASTM E-84; (c) covering seams between polymeric foam boards with a sealing tape; (d) affixing a plurality of fasteners through the thermally insulating layer to structural members with the fasteners extending beyond the outside surface of the thermally insulating layer; (e) attaching a façade selected from metal panel, metal-composite-metal panels, fiber reinforced cementitious siding veneer and materials having a thickness of at least 1.9 centimeters (0.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: March 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffrey M. Hansbro, Michael J. Kontranowski, Daniel R. Schroer, Daniel A. Tempas
  • CONTINUOUSLY INSULATED WALL ASSEMBLY
    Publication number: 20090320397
    Abstract: Construct a wall assembly by: (a) providing a support structure with spaced apart structural members; (b) affixing a thermally insulating layer of polymeric foam boards to the structural members, the foam boards achieving a Class A rating according to ASTM E-84; (c) covering seams between polymeric foam boards with a sealing tape; (d) affixing a plurality of fasteners through the thermally insulating layer to structural members with the fasteners extending beyond the outside surface of the thermally insulating layer; (e) attaching a façade selected from metal panel, metal-composite-metal panels, fiber reinforced cementitious siding veneer and materials having a thickness of at least 1.9 centimeters (0.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 31, 2009
    Inventors: Jeffrey M. Hansbro, Michael J. Kontranowski, Daniel R. Schroer, Daniel A. Tempas