Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

Abstract: A detector array such as for use in a radiation imaging modality is provided. The detector array includes a first pixel (302a) having a first scintillator (402). The first scintillator has a first detection surface (408) and a first light emission surface (412). The first detection surface extends along a first detection surface plane and the first light emission surface extends along a first light emission surface plane. The detector array includes a second pixel (302b) having a second scintillator (420). The second scintillator has a second detection surface (426) and a second light emission surface (430). The second detection surface extends along a second detection surface plane and the second light emission surface extends along a second light emission surface plane. At least one of the first detection surface plane is not coplanar with the second detection surface plane or the first light emission surface plane is not coplanar with the second light emission surface plane.

Abstract: A sample processing system includes a sample carrier support configured to concurrently support multiple sample carriers in series, each sample carrier carrying a respective sample to be processed. The apparatus also includes a plurality of processing stations located at different positions along the sample carry support, each processing station configured to perform a different processing act of a plurality of processing acts to be performed on each sample. The apparatus further includes a support mover that moves the sample support and hence the sample carriers sequentially from processing station to processing station for processing.

Abstract: A sample processing system includes a sample carrier support configured to concurrently support multiple sample carriers in series, each sample carries carrying a respective sample to be processed. The apparatus also includes a plurality of processing stations located at different positions along the sample carry support, each processing station configured to perform a different processing act of a plurality of processing acts to be performed on each sample. The apparatus further includes a support mover that moves the sample support and hence the sample carriers sequentially from processing station to processing station for processing.

Abstract: Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

Abstract: One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract: Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

Abstract: A sample carrier (102) includes a sample support region (104) that supports a sample to be processed by a sample carrier processing apparatus and storage and communications circuitry (106) that includes a wireless interface (502) that wirelessly communicates with a storage component reader of the sample processing apparatus when the sample carrier is loaded in the sample processing apparatus for processing. A sample carrier processing apparatus (100) includes a plurality of sample carrier receiving regions (116) respectively configured to receive individual sample carriers carrying samples to be processed by the sample carrier processing apparatus and a plurality of storage component readers (120), one for each of the plurality of sample carrier receiving regions and respectively configured to wirelessly communicate, one to one, with the sample carrier in a corresponding one of the sample carrier receiving regions.

Abstract: A detector array such as for use in a radiation imaging modality is provided. The detector array includes a first pixel (302a) having a first scintillator (402). The first scintillator has a first detection surface (408) and a first light emission surface (412). The first detection surface extends along a first detection surface plane and the first light emission surface extends along a first light emission surface plane. The detector array includes a second pixel (302b) having a second scintillator (420). The second scintillator has a second detection surface (426) and a second light emission surface (430). The second detection surface extends along a second detection surface plane and the second light emission surface extends along a second light emission surface plane. At least one of the first detection surface plane is not coplanar with the second detection surface plane or the first light emission surface plane is not coplanar with the second light emission surface plane.

Abstract: Among other things, a radiation system configured to examine an object is provided. The radiation system comprises, among other things, a radiation source, a detector array, and an object support. The object support is configured to rotate an object and to translate the object during the examination to facilitate acquiring volumetric data indicative of the object. In some embodiments, the detector array comprises a single row of detector cells and the radiation source emits fan-beam radiation. In some embodiments, the radiation system further comprises an image generator configured to generate an image of a surface of the object based upon first data corresponding to a first ray having a first trajectory and intersecting a first location within the object and second data corresponding to a second ray having a second trajectory and intersecting the first location within the object.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract: A scanner (200) includes a radiation source (202) that emits radiation that traverses a scanning region and a detector array (204), including a line of detectors (302), that detects radiation traversing the scanning region, wherein the radiation source and the detector array are located on opposing sides of the scanning region. The scanner further includes a mover (208) configured to move an object through the scanning region when scanning the object. The line of detectors (302) is configured to move in a plane, which is substantially parallel to the scanning region, in coordination with the mover moving the object, thereby creating a plane of detection for scanning the object.

Abstract: One or more techniques and/or systems described herein provide for a detector array having an effective size that is larger than its actual size of its elements, thus reducing costs by reducing materials required. In one embodiment, one or more channels of the detector array are removed (e.g., and filled with a radiation absorbing material) to create what may be referred to as a sparse array. In another embodiment, one or more channels of a detector array comprise a detection portion and a dead space (e.g., filled with a radiation absorbing material). In yet another embodiment, one or more channels of a detector array comprise light focusing mechanisms configured to focus light from a scintillator portion of an indirect conversion detector array to a photodetector portion of the detector array, where a detection surface area of the photodetector is less than a detection surface area of the scintillator.

Abstract: Among other things, a rotatable drum for a radiology imaging modality is provided herein. The rotatable drum comprises a bore, defined by an inner circumference of a sidewall of the rotatable drum. In one embodiment, the sidewall comprises one or more apertures through which radiation may pass. By way of example, a radiation source and a detector array may be mounted outside of the bore (e.g., on an outside surface of the sidewall) and apertures in the sidewall may permit radiation to pass from the radiation source to the detector array without being attenuated by the sidewall of the drum. In another embodiment, the detector array may be comprised of a plurality of detector modules that may be individually mounted/dismounted from the rotatable drum, and in one example, may provide structural support to the rotatable drum.

Abstract: One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

Abstract: The techniques described herein provide a means for generating an x-ray image and ultrasound image depicting parallel planes of an object under examination and may be used in conjunctions with x-ray or ultrasound techniques known to those in the field (e.g., x-ray tomosynthesis, computed tomography ultrasound imaging, etc.). In one example, one or more x-ray images are spatially coincident to one or more ultrasound images and the images may be combined through spatial registration. It finds particular application to mammography examinations but may be used in other fields that use information from multiple modalities.

Abstract: Among other things, one or more tiles for an indirect-conversation radiation detector array are provided herein. Respective tiles comprise a detector sub-assembly and an electronic sub-assembly, which are operably coupled together, yet selectively removable, via a connection interface. When an electronic sub-assembly portion of a tile, which comprises a signal acquisition system (e.g., an integrated circuit, such as an application specific integrated circuit (ASIC)), functions improperly, the electronic sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the detector sub-assembly (e.g., which may be much more costly to replace). Similarly, when the detector sub-assembly portion of a tile functions improperly, the detector sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the electronic sub-assembly portion of the tile (e.g.

Abstract: A sample carrier (102) includes a sample support region (104) that supports a sample to be processed by a sample carrier processing apparatus and storage and communications circuitry (106) that includes a wireless interface (502) that wirelessly communicates with a storage component reader of the sample processing apparatus when the sample carrier is loaded in the sample processing apparatus for processing. A sample carrier processing apparatus (100) includes a plurality of sample carrier receiving regions (116) respectively configured to receive individual sample carriers carrying samples to be processed by the sample carrier processing apparatus and a plurality of storage component readers (120), one for each of the plurality of sample carrier receiving regions and respectively configured to wirelessly communicate, one to one, with the sample carrier in a corresponding one of the sample carrier receiving regions.