Patents by Inventor Daniel Bolliger

Daniel Bolliger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for calibrating a bondhead
    Patent number: 7184909
    Abstract: The position of the gripper axis of the chip gripper of a bondhead of an apparatus for mounting semiconductor chips is determined with the aid of a stationary arranged photodetector. The chip gripper contains a suction organ with a suction opening that defines the position of the gripper axis. The chip gripper contains a shaft with a longitudinal drill hole to which vacuum can be applied that is illuminated so that light emerges out of the suction opening of the suction organ. The bondhead is moved over edges of the photodetector and co-ordinates that characterise the position of the gripper axis are determined from the output signal of the photodetector and the position signal of the bondhead. If this method is carried out for different rotary positions of the chip gripper, then any offset of the gripper axis relative to the rotational axis of the bondhead can also be determined.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: February 27, 2007
    Assignee: Unaxis International Trading Ltd.
    Inventor: Daniel Bolliger
  • Method for calibrating a bondhead
    Publication number: 20050132773
    Abstract: The position of the gripper axis of the chip gripper of a bondhead of an apparatus for mounting semiconductor chips is determined with the aid of a stationary arranged photodetector. The chip gripper contains a suction organ with a suction opening that defines the position of the gripper axis. The chip gripper contains a shaft with a longitudinal drill hole to which vacuum can be applied that is illuminated so that light emerges out of the suction opening of the suction organ. The bondhead is moved over edges of the photodetector and co-ordinates that characterise the position of the gripper axis are determined from the output signal of the photodetector and the position signal of the bondhead. If this method is carried out for different rotary positions of the chip gripper, then any offset of the gripper axis relative to the rotational axis of the bondhead can also be determined.
    Type: Application
    Filed: December 8, 2004
    Publication date: June 23, 2005
    Inventor: Daniel Bolliger
  • Method for picking semiconductor chips from a foil
    Publication number: 20040105750
    Abstract: The picking of a semiconductor chip from a foil takes place by means of a chip gripper which bears on a bondhead and can be deflected in a predetermined direction and with the aid of a needle. An inductive sensor serves the precise measurement of the deflection of the chip gripper with reference to the bondhead.
    Type: Application
    Filed: November 20, 2003
    Publication date: June 3, 2004
    Applicant: ESEC TRADING SA, A Swiss Corporation
    Inventors: Daniel Bolliger, Dominik Hartmann, Felix Leu, Eugen Mannhart