Patents by Inventor Daniel C. Haeg

Daniel C. Haeg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8926635
    Abstract: A novel occluder application and clip device for treatment of embolic stroke caused by atrial fibrillation uses multiple sutures in a non directional handle to affix the occlusion device to the applicator and manipulate the occluder from an open and receiving position to a closed and occluding position. The occluder is retained in place by a clamping means related to locks retainers, resilient material or otherwise. An actuator mechanism is used to manipulate the occluder to a locked or occluding position. The applicator with the occluder attached has a low profile and remote manipulations to allow the occluder to be delivered to the clamping location within a patient through a small incision or delivery port such as a trocar cannula or the like.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: January 6, 2015
    Assignee: Medtronic, Inc.
    Inventors: David E. Francischelli, Roderick E. Briscoe, Leonard H. Leuer, Daniel C. Haeg, Tom P. Daigle, David Kim, Mark T. Stewart, Andrew L. Olson, Patrick J. Cloutier, Christopher W. Smith, Michael J. Hobday, Tessy Kanayinkal, Douglas H. Gubbin, Paul T. Rothstein, Joseph E. Cardinal, Jessica L. Foley, Christopher J. Plott
  • Patent number: 8663245
    Abstract: The invention provides a system for occluding a left atrial appendage of a patient. The system can include a ring occluder that can be positioned around the left atrial appendage and a ring applicator to position the ring occluder with respect to the left atrial appendage. The system can also provide a tissue-grasping tool that is separable from the ring applicator tool.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: March 4, 2014
    Assignee: Medtronic, Inc.
    Inventors: David E. Francischelli, Roderick E. Briscoe, Leonard H. Leuer, Daniel C. Haeg, Tom P. Daigle, David Kim, Mark T. Stewart, Andrew L. Olson, Patrick J. Cloutier, Christopher W. Smith, Michael J. Hobday, Tessy Kanayinkal, Douglas H. Gubbin, Paul T. Rothstein, Joseph E. Cardinal, Jessica L. Foley, Christopher J. Plott
  • Publication number: 20100145361
    Abstract: A novel occluder application and clip device for treatment of embolic stroke caused by atrial fibrillation uses multiple sutures in a non directional handle to affix the occlusion device to the applicator and manipulate the occluder from an open and receiving position to a closed and occluding position. The occluder is retained in place by a clamping means related to locks retainers, resilient material or otherwise. An actuator mechanism is used to manipulate the occluder to a locked or occluding position. The applicator with the occluder attached has a low profile and remote manipulations to allow the occluder to be delivered to the clamping location within a patient through a small incision or delivery port such as a trocar cannula or the like.
    Type: Application
    Filed: October 2, 2009
    Publication date: June 10, 2010
    Inventors: David E. Francischelli, Roderick E. Briscoe, Leonard H. Leuer, Daniel C. Haeg, Tom P. Daigle, David Kim, Mark T. Stewart, Andrew L. Olson, Patrick J. Cloutier, Christopher W. Smith, Michael J. Hobday, Tessy Kanayinkal, Douglas H. Gubbin, Paul T. Rothstein, Joseph E. Cardinal, Jessica L. Foley, Christopher J. Plott
  • Patent number: 7231253
    Abstract: An implantable medical device (IMD) includes a connector header for making electrical and mechanical connections with a proximal connector assembly of an electrical medical lead and includes a retainer for retaining a penetrable grommet within a header grommet aperture. A connector block disposed within a header body of the connector header has a threaded bore aligned with a header grommet aperture and a connector block bore aligned with a header connector bore. The penetrable grommet is disposed within the header grommet aperture, and a setscrew is threaded into the threaded bore having a setscrew socket disposed to be engaged by a tool inserted through the penetrable grommet within the header grommet aperture to enable rotation of the setscrew within the threaded bore to tighten the setscrew against or to loosen the setscrew from a lead connector element received in the header connector bore.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: June 12, 2007
    Assignee: Medtronic, Inc.
    Inventors: Kevin K. Tidemand, Daniel C. Haeg, Craig L. Wiklund, James F. Kelley, Jennifer J. Zhao, Andrew J. Ries, David C. Rice, Hui J. Jin, James J. Christenson, Loc Van Vo
  • Patent number: 7187974
    Abstract: The present invention generally relates to an improved implantable medical device (IMD) and more particularly to an ultrasonically weld perforated lid for an IMD to form a hermetic seal between the IMD and the perforated lid. Appropriately configured perforated lids retain one or more components within a cavity or port formed in a part of an IMD. Such lids preferably secure a pierceable resilient grommet, septum or other resilient member in a cavity or port. When an adjustment instrument, a pull tool or a syringe is temporarily inserted therethrough and later extracted, the resilient member heals (i.e., seals and/or reseals). Preferably, the resilient member abuts a mechanical stop and is compressed slightly during assembly and ultrasonic welding of the lid. The resilient member preferably has a lateral dimension like the cavity or port so that when the lid compresses the resilient member it expands slightly and contacts the interior cavity surfaces thus improving the seal.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: March 6, 2007
    Assignee: Medtronic, Inc.
    Inventors: Daniel C. Haeg, Craig L. Wiklund, James F. Kelley
  • Publication number: 20040122481
    Abstract: Improvements in connector headers of implantable medical devices (IMDs) for making electrical and mechanical connections with a connector element of a proximal connector assembly of an electrical medical lead and components thereof are disclosed. A connector block disposed within a header body of the connector header has a threaded bore aligned with a header grommet aperture and a connector block bore aligned with a header connector bore. A penetrable grommet is disposed within the header grommet aperture, and a setscrew is threaded into the threaded bore having a setscrew socket disposed to be engaged by the tool inserted through the penetrable grommet within the header grommet aperture to enable rotation of the setscrew within the threaded bore to tighten the setscrew against or to loosen the setscrew from a lead connector element received in the header connector bore.
    Type: Application
    Filed: December 11, 2003
    Publication date: June 24, 2004
    Inventors: Kevin K. Tidemand, Daniel C. Haeg, Craig L. Wiklund, James F. Kelley, Jennifer J. Zhao, Andrew J. Ries, David C. Rice, Hui J. Jin, James J. Christenson, Loc Van Vo
  • Publication number: 20030040780
    Abstract: The present invention generally relates to an improved implantable medical device (IMD) and more particularly to an ultrasonically weld perforated lid for an IMD to form a hermetic seal between the IMD and the perforated lid. Appropriately configured perforated lids retain one or more components within a cavity or port formed in a part of an IMD. Such lids preferably secure a pierceable resilient grommet, septum or other resilient member in a cavity or port. When an adjustment instrument, a pull tool or a syringe is temporarily inserted therethrough and later extracted, the resilient member heals (i.e., seals and/or reseals). Preferably, the resilient member abuts a mechanical stop and is compressed slightly during assembly and ultrasonic welding of the lid. The resilient member preferably has a lateral dimension like the cavity or port so that when the lid compresses the resilient member it expands slightly and contacts the interior cavity surfaces thus improving the seal.
    Type: Application
    Filed: July 19, 2002
    Publication date: February 27, 2003
    Applicant: Medtronic, Inc.
    Inventors: Daniel C. Haeg, Craig L. Wiklund, James F. Kelley
  • Publication number: 20010034543
    Abstract: The present invention generally relates to implantable medical devices and more particularly to various means for ultrasonically welding, swaging or staking various components in an implantable medical device, most preferably by employing appropriately configured covers or lids. Covers or lids are attached to header or connector modules mounted on an hermetically enclosed and sealed enclosure, where the connector or header module and enclosure comprise an implantable medical device. The covers or lids preferably trap or otherwise secure any of a number of various connector or header module components within the header or connector modules. Examples of such trapped or secured components include grommets, set screw connector blocks, seals, feedthrough wires, multi-beam contacts, electrical contacts, antennas, radio-opaque markers, connector ribbons and the like.
    Type: Application
    Filed: January 23, 2001
    Publication date: October 25, 2001
    Inventors: Daniel C. Haeg, Craig L. Wiklund, James F. Kelley
  • Patent number: 6205358
    Abstract: The present invention generally relates to implantable medical devices and more particularly to various means for ultrasonically welding, swaging or staking various components in an implantable medical device, most preferably by employing appropriately configured covers or lids. Covers or lids are attached to header or connector modules mounted on an hermetically enclosed and sealed enclosure, where the connector or header module and enclosure comprise an implantable medical device. The covers or lids preferably trap or otherwise secure any of a number of various connector or header module components within the header or connector modules. Examples of such trapped or secured components include grommets, set screw connector blocks, seals, feedthrough wires, multi-beam contacts, electrical contacts, antennas, radio-opaque markers, connector ribbons and the like.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: March 20, 2001
    Assignee: Medtronic, Inc.
    Inventors: Daniel C. Haeg, Craig L. Wiklund, James F. Kelley
  • Patent number: 6010803
    Abstract: A cover for an electrochemical cell is molded by a metal injection molding process. The cover includes a main body portion completely integral with a feedthrough ferrule portion for accommodating an electrical lead to pass through the cover and/or completely integral with a fillport portion for introducing cathode material into the cell.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: January 4, 2000
    Assignee: Medtronic, Inc.
    Inventors: Bernard F. Heller, Jr., Scott E. Jahns, Daniel C. Haeg
  • Patent number: 5919215
    Abstract: A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: July 6, 1999
    Assignee: Medtronic, Inc.
    Inventors: Craig L. Wiklund, Daniel C. Haeg, James F. Kelley
  • Patent number: 5897578
    Abstract: A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: April 27, 1999
    Assignee: Medtronic, Inc.
    Inventors: Craig L. Wiklund, Daniel C. Haeg, James F. Kelley
  • Patent number: 5871515
    Abstract: A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: February 16, 1999
    Assignee: Medtronic, Inc.
    Inventors: Craig L. Wiklund, Daniel C. Haeg, James F. Kelley
  • Patent number: 5871514
    Abstract: A method and apparatus for attaching a pre-formed header module to a hermetically sealed enclosure of an implantable medical device are described. A plurality of upstanding tabs attached to the hermetically sealed enclosure extend into a plurality of corresponding tab channels formed in the header module. The upstanding tabs are inserted into the respective tab channels during seating of the module and enclosure attachment surfaces and effect an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature such as a recess formed on or in the tab that is designed to receive molten thermoplastic material when ultrasonic energy is applied in the region of the tab channel.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: February 16, 1999
    Assignee: Medtronic, Inc.
    Inventors: Craig L. Wiklund, Daniel C. Haeg, James F. Kelley
  • Patent number: 5198033
    Abstract: A plasma treatment apparatus for treating strip-stock material, such as tubing, wire, webs, and the like, by moving the strip-stock through a plasma treatment region of the apparatus provides improved consistency of surface treatment if the tension on the material is maintained within a predetermined range.
    Type: Grant
    Filed: October 31, 1991
    Date of Patent: March 30, 1993
    Assignee: Medtronic, Inc.
    Inventors: James Kelley, Paul Rudolph, Gordon R. Helmer, Daniel C. Haeg, Roger C. Erickson
  • Patent number: 4944088
    Abstract: A cardiac pacing lead has a plurality of individually insulated conductors arranged as a multifilar coil. The lead includes a connector assembly and a ring electrode assembly, each of which are optimized for use in conjunction with conductors arranged in the form of a multifilar coil. The connector assembly takes the form of an in-line connector having a plurality of linearly arranged connecting surfaces, each coupled to one of the conductors in the multifilar coil. The ring electrode assembly is constructed such that it displays the same outer diameter as the pacing lead. In both assemblies, conductors are coupled by means of welds, rather than by crimping or swaging.
    Type: Grant
    Filed: May 25, 1988
    Date of Patent: July 31, 1990
    Assignee: Medtronic, Inc.
    Inventors: Phong D. Doan, Kenneth E. Cobian, James E. Upton, Daniel C. Haeg