Abstract: Method for on-chip stress decoupling to reduce stresses in a vertical hybrid integrated component including MEMS and ASIC elements and to mechanical decoupling of the MEMS structure. The MEMS/ASIC elements are mounted above each other via at least one connection layer and form a chip stack. On the assembly side, at least one connection area is formed for the second level assembly and for external electrical contacting of the component on a component support. At least one flexible stress decoupling structure is formed in one element surface between the assembly side and the MEMS layered structure including the stress-sensitive MEMS structure, in at least one connection area to the adjacent element component of the chip stack or to the component support, the stress decoupling structure being configured so that the connection material does not penetrate into the stress decoupling structure and flexibility of the stress decoupling structure is ensured.

Abstract: Measures are provided which are used for stabilizing the substructure of the connecting areas of ASIC elements. These measures relate to ASIC elements including an ASIC substrate, into which electrical circuit functions are integrated, and including an ASIC layer structure on the ASIC substrate, which includes multiple wiring levels for the circuit functions, which are separated from one another by insulation layers and are interconnected via metallic plugs. At least one connecting area for placing wire bonds or for wafer bonding is implemented in at least one of the uppermost wiring levels. At least one chain of metallic plugs arranged vertically in a direct line is implemented in the ASIC layer structure below the connecting area, which extends from the uppermost wiring level up to the ASIC substrate or oxide trenches introduced therein.

Abstract: The disclosure relates to a micromechanical rotary acceleration sensor including a substrate with at least one anchoring device and at least two flywheel masses. At least one of the flywheel masses is connected to at least one anchoring device by means of a coupling element. The at least one anchoring device is designed in such a manner that the at least two flywheel masses are elastically deflectable from a respective rest position about at least one axis of rotation. The at least two flywheel masses is designed in such a manner that they have different natural frequencies.

Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Abstract: A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, where the movable substructures are excitable into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, where deflections of the Coriolis elements induced by a Coriolis force are detectable, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Abstract: A yaw-rate sensor for determining a Coriolis force includes a semiconductor substrate, a mass body mounted so it is movable over the semiconductor substrate, a drive unit for setting the mass body into an oscillating movement, and a detection unit for determining a deflection of the mass body which is caused by the Coriolis force. The detection unit includes a piezoresistive element, whose electrical resistance is a function of the deformation of the piezoresistive element.

Abstract: A yaw rate sensor is described which includes a drive device, at least one Coriolis element, and a detection device having at least two detection elements which are coupled to one another with the aid of a coupling device, the drive device being connected to the Coriolis element for driving a vibration of the Coriolis element, and an additional coupling device which is connected to the detection device and to the Coriolis element for coupling a deflection in the plane of vibration of the Coriolis element to the detection device in a direction orthogonal to the vibration.

Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

Abstract: A yaw-rate sensor and a method for operating a yaw-rate sensor having a first Coriolis element and a second Coriolis element are proposed, the yaw-rate sensor having a substrate having a main plane of extension, the yaw-rate sensor having a first drive element for driving the first Coriolis element in parallel to a second axis, the yaw-rate sensor having a second drive element for driving the second Coriolis element in parallel to the second axis, the yaw-rate sensor having detection means for detecting deflections of the first Coriolis element and of the second Coriolis element in parallel to a first axis due to a Coriolis force, the second axis being situated perpendicularly to the first axis, the first and second axis being situated in parallel to the main plane of extension, the first and second drive elements being mechanically coupled to each other via a drive coupling element.

Abstract: A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.

Abstract: A yaw rate sensor having a substrate which has a main plane of extension, and a Coriolis element is proposed. The Coriolis element is excitable to a vibration along a third direction which is perpendicular to the main plane of extension. A Coriolis deflection of the Coriolis element along a first direction which is parallel to the main plane of extension may be detected using a detection arrangement. The detection arrangement includes a Coriolis electrode which is connected to the Coriolis element, and a corresponding counterelectrode. Both the Coriolis electrode and the counterelectrode may be excited to a vibration along the third direction.

Abstract: A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Abstract: A yaw rate sensor includes: at least one Coriolis element; a drive device connected to the Coriolis element and configured to drive a vibration of the Coriolis element; a detection device having at least one rotor; and a coupling device connected to the detection device and to the Coriolis element. The coupling device is configured to couple a deflection in the plane of vibration of the Coriolis element to the detection device in a direction orthogonal to the vibration, so that when the Coriolis element is deflected a torque for driving the at least one rotor is transmitted from the Coriolis element to the at least one rotor.

Abstract: A coupling structure for a rotation rate sensor apparatus, having at least one first oscillating mass; and having a first frame, surrounding the first oscillating mass, to which the first oscillating mass is coupled; the first frame encompassing four angle elements, each of which angle elements has at least one first limb and one second limb and is respectively coupled with the first limb and with the second limb to another adjacent angle element of the four angle elements. Also described is a further coupling structure for a rotation rate sensor apparatus, to a rotation rate sensor apparatus, to a manufacturing method for a coupling structure for a rotation rate sensor apparatus, and to a manufacturing method for a rotation rate sensor apparatus.

Abstract: A yaw-rate sensor includes: a substrate having a main extension plane for detecting a yaw rate about a first axis extending parallel to the main extension plane; a first Coriolis element; a second Coriolis element; a third Coriolis element; and a fourth Coriolis element. The first Coriolis element and the fourth Coriolis element are drivable in the same direction parallel to a second axis extending parallel to the main extension plane and perpendicularly to the first axis. The first Coriolis element and the second Coriolis element are drivable in opposite directions parallel to the second axis. The first Coriolis element and the third Coriolis element are drivable in opposite directions parallel to the second axis.

Abstract: A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.

Abstract: A yaw-rate sensor is described as having a substrate which has a main plane of extension for detecting a yaw rate about a first axis extending parallel to the main plane of extension is provided, the yaw-rate sensor having a first rotation element and a second rotation element, the first rotation element being drivable about a first axis of rotation, the second rotation element being drivable about a second axis of rotation, the first axis of rotation being situated perpendicularly to the main plane of extension, the second axis of rotation being situated perpendicularly to the main plane of extension, the first rotation element and the second rotation element being drivable in opposite directions.

Abstract: A rotational rate sensor includes: a substrate having a main plane of extension; a first Coriolis element; and a second Coriolis element. The first Coriolis element and the second Coriolis element have a first and a second center of gravity, respectively, and the elements are drivable along a drive direction. In the idle state of the rotational rate sensor, (i) the distance between the first center of gravity and the second center of gravity along the detection direction is less than a first value, and (ii) the distance between the first center of gravity and the second center of gravity along the third direction is less than a second value.