Abstract: A motorsport helmet includes a shell having a lower edge, a liner extending along an interior of the shell, and a support portion coupled to the shell and extending between the shell and the liner adjacent the lower edge. In some configurations, when the helmet is positioned on a DOT Standard No. 218 test head form, a portion of the lower edge is above the test line and a portion of the lower edge is below the test line, and the support portion extends from the portion of the lower edge that is above the test line to a location below the test line. The helmet may also include a muzzle adapted to cover the mouth and chin area of a wearer, and a magnetic coupling assembly releasably coupling the muzzle to the shell.

Abstract: A motorsport helmet includes a shell having a lower edge, a liner extending along an interior of the shell, and a support portion coupled to the shell and extending between the shell and the liner adjacent the lower edge. In some configurations, when the helmet is positioned on a DOT Standard No. 218 test head form, a portion of the lower edge is above the test line and a portion of the lower edge is below the test line, and the support portion extends from the portion of the lower edge that is above the test line to a location below the test line. The helmet may also include a muzzle adapted to cover the mouth and chin area of a wearer, and a magnetic coupling assembly releasably coupling the muzzle to the shell.

Abstract: A motorsport helmet includes a shell having a lower edge, a liner extending along an interior of the shell, and a support portion coupled to the shell and extending between the shell and the liner adjacent the lower edge. In some configurations, when the helmet is positioned on a DOT Standard No. 218 test head form, a portion of the lower edge is above the test line and a portion of the lower edge is below the test line, and the support portion extends from the portion of the lower edge that is above the test line to a location below the test line. The helmet may also include a muzzle adapted to cover the mouth and chin area of a wearer, and a magnetic coupling assembly releasably coupling the muzzle to the shell.

Abstract: A helmet may include a helmet body with a plurality of spars separated from each other by a plurality of channels extending from an inner surface of the helmet body to an outer surface of the helmet body, the spars formed primarily of a foamed energy management material. Each of the plurality of spars is separated from at least one adjacent spar of the plurality of spars by a different one of the plurality of channels having a width no greater than 30 mm. At least two spars are separated from each other by an enlarged channel having a width greater than at least 60 mm. At least one shell segment formed of a fiber filled plastic is directly coupled around a majority of its border to the at least two spars separated by the enlarged channel and spanning the enlarged channel.

Abstract: Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other.

Abstract: Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other.

Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

Abstract: Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.

Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

Abstract: A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on the module with a zero insertion force on the modules. The interface board is configured for mounting to an automated or manual pass through test handler in electrical communication with test circuitry. In a first embodiment the interface board includes test pads in electrical communication with the test circuitry, and rotatable test contactors having spring contacts configured to simultaneously engage the test pads and the terminal contacts on the module. In a second embodiment the interface board includes test pads in electrical communication with the test circuitry, and slidable test contactors having beam leads configured to simultaneously engage the test pads and the terminal contacts on the module.

Abstract: Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

Abstract: Integrated circuit package testing devices having a substrate with a cavity, and a device connecting a latch to said substrate, wherein said latch provides an unobstructed path to a center of the cavity, and the method for making and using the devices.

Abstract: Disclosed herein are exemplary embodiments of a contact system (referred to as a “Z-block”) for interfacing a semiconductor wafer to an electrical tester, and methods for making the same. In a preferred embodiment, the Z-block comprises three stacked pieces or layers: an upper and lower piece which are similar in structure, and a unique middle piece. The pieces each contain corresponding locking holes and probe pin holes. The locking holes are strategically arranged on each of the pieces to allow the stacked piece structure to be locked together at various points during its manufacture. After alignment of the probe pin holes in the various pieces, probe pins are injected into these holes. The probe pins are then aligned and locked into place by moving the middle piece relative to the upper and lower pieces. Such locking of the probe pins is accomplished through interaction of the middle piece with the shape of the probe pins, which prevents the probe pins from slipping out of the probe pin holes.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.