Patents by Inventor Daniel DeBeer

Daniel DeBeer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDWIRE UTILIZED FOR COULOMB COUNTING AND SAFETY CIRCUITS
    Publication number: 20080099897
    Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.
    Type: Application
    Filed: December 26, 2007
    Publication date: May 1, 2008
    Applicant: INTERSIL AMERICAS INC.
    Inventors: DANIEL DeBeer, LANCE CHANDLER
  • Bondwire utilized for coulomb counting and safety circuits
    Publication number: 20060249822
    Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.
    Type: Application
    Filed: September 2, 2005
    Publication date: November 9, 2006
    Inventors: Daniel DeBeer, Lance Chandler