Patents by Inventor Daniel Dragoon
Daniel Dragoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6765797Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: GrantFiled: December 19, 2002Date of Patent: July 20, 2004Assignee: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Publication number: 20030076657Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: ApplicationFiled: December 19, 2002Publication date: April 24, 2003Applicant: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Patent number: 6535387Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: GrantFiled: June 28, 2001Date of Patent: March 18, 2003Assignee: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Publication number: 20030011993Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: ApplicationFiled: June 28, 2001Publication date: January 16, 2003Applicant: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Patent number: 4935856Abstract: The surface mounted LED package disclosed herein includes an LED having a first surface, a second surface opposite to the first surface, two electrical contacts on the first surface, and a light emitting portion in the second surface; a housing mounted on the LED and having a generally rectangular parallelepipedal shape, a first passageway extending from a first surface of the housing part way through the housing, the first passageway being sized, shaped, and positioned to receive the second surface of the LED such that the light emitting portion of the second surface faces into the first passageway, and a second passageway extending from a second surface of the housing to a third surface of the housing and communicating with the first passageway; and a lens received in the second passageway and having a first radiating surface located outside the housing and an internal reflecting surface located inside the housing above the light emitting portion of the LED in position to reflect light from the light emittiType: GrantFiled: October 5, 1989Date of Patent: June 19, 1990Assignee: Dialight CorporationInventor: Daniel Dragoon
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Patent number: D472581Type: GrantFiled: August 27, 2001Date of Patent: April 1, 2003Assignee: Intel CorporationInventors: Mark D. Summers, Javier Leija, Daniel Dragoon, Cory W. Worth
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Patent number: RE34254Abstract: The surface mounted LED package disclosed herein includes an LED having a first surface, a second surface opposite to the first surface, two electrical contacts on the first surface, and a light emitting portion in the second surface; a housing mounted on the LED and having a generally rectangular parallelepipedal shape, a first passageway extending from a first surface of the housing part way through the housing, the first passageway being sized, shaped, and positioned to receive the second surface of the LED such that the light emitting portion of the second surface faces into the first passageway, and a second passageway extending from a second surface of the housing to a third surface of the housing and communicating with the first passageway; and a lens received in the second passageway and having a first radiating surface located outside the housing and an internal reflecting surface located inside the housing above the light emitting portion of the LED in position to reflect light from the light emittiType: GrantFiled: June 12, 1991Date of Patent: May 18, 1993Assignee: Dialight CorporationInventor: Daniel Dragoon