Patents by Inventor Daniel F. Douriet

Daniel F. Douriet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave circuit packages having a reduced number of vias in the substrate
    Patent number: 6426686
    Abstract: A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.
    Type: Grant
    Filed: June 16, 1999
    Date of Patent: July 30, 2002
    Assignee: Microsubstrates Corporation
    Inventors: Daniel F. Douriet, Jorge M. Hernandez, M. P. Ramachandra Panicker
  • MICROWAVE CIRCUIT PACKAGES HAVING A REDUCED NUMBER OF VIAS IN THE SUBSTRATE
    Publication number: 20020075105
    Abstract: A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.
    Type: Application
    Filed: June 16, 1999
    Publication date: June 20, 2002
    Inventors: DANIEL F. DOURIET, JORGE M. HERNANDEZ, M.P. RAMACHANDRA PANICKER
  • Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
    Patent number: 6215377
    Abstract: A MMIC package comprises a trace pattern of a coplanar wave guide which matches impedances at all transitions to enhance signal transmission and avoid reflection. The invention employs metalization on a dielectric substrate material wherein this metalization is patterned in order to provide gaps and signal carrying conductors which enhance the signal propagation and reduce impedance mismatches in order to provide a package capable of handling high frequency microwave signals.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: April 10, 2001
    Assignee: Microsubstrates Corporation
    Inventor: Daniel F. Douriet