Patents by Inventor Daniel Hogan
Daniel Hogan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120030276Abstract: A system for generating web analytic reports is provided. The system includes a processor configured to receive an input web page link, execute a unified tag for the input web page link, and generate unified tagged data based on the executed unified tag. The system also includes a server side translation unit configured to translate the unified tagged data to corresponding client tagged data for each of a plurality of clients. The system further includes a plurality of client side analytical units associated with a corresponding client among the plurality of clients and communicatively coupled to the server side translation unit, wherein at least a portion of the client side analytical units are configured to analyze the corresponding client tagged data for each of the plurality of clients and generate a corresponding client side web analytics report for each of the plurality of clients.Type: ApplicationFiled: July 30, 2010Publication date: February 2, 2012Applicant: GENERAL ELECTRIC COMPANYInventors: Babu Ozhur Narayanan, Vineel Chandrakanth Gujjar, Jayanth Kalle Marasanapalle, Daniel Hogan, Christopher Johannessen
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Publication number: 20120005257Abstract: A system for generating web analytic reports includes a client interface unit configured to receive one or more predefined tagging conditions from a client for generating a set of tagging rules based on the one or more predefined tagging conditions. The system also includes a tag generation unit configured to generate a client tagged data based on the set of tagging rules. The system also includes an output interface unit configured to generate web analytic reports via analyzing the client tagged data based on the set of tagging rules.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Applicant: GENERAL ELECTRIC COMPANYInventors: Babu Ozhur Narayanan, Vineel Chandrakanth Gujjar, Jayanth Kalle Marasanapalle, Daniel Hogan
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Patent number: 7699114Abstract: An oil and gas well assembly is provided that includes a wireline cable having at least one optical fiber; a downhole tool having at least one optical fiber; and a cablehead having a first end connected to the wireline cable, a second end connected to the downhole tool. The cablehead further includes at least one optical fiber which transmits data between the at least one downhole tool optical fiber and the at least one wireline cable optical fiber.Type: GrantFiled: August 30, 2006Date of Patent: April 20, 2010Assignee: Schlumberger Technology CorporationInventors: Kalim Ullah, Montie W. Morrison, Daniel Hogan
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Patent number: 7438482Abstract: The present invention provides cells which are capable of transmitting both optical information and electrical signals when connected with each other, and a packaging system in which these cells are connected. A first connector and a second connector are formed on each cell. These two connectors are configured complementary to each other. When two cells are pressed against each other with the first connector of one of the cells facing the second connector of the other, electrical connectors engage with each other, whereby the cells are connected electrically and mechanically. A first optical device and a second optical device are also disposed in complementary positions. When the cells are connected electrically and mechanically, the tip of the first optical device and the tip of the second optical device are brought into contact with each other, allowing an optical signal to be transmitted.Type: GrantFiled: July 26, 2005Date of Patent: October 21, 2008Assignee: Matsushita Electric Industrial Co. Ltd.Inventors: Takuma Asari, Daniel Hogan
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Publication number: 20080053654Abstract: An oil and gas well assembly is provided that includes a wireline cable having at least one optical fiber; a downhole tool having at least one optical fiber; and a cablehead having a first end connected to the wireline cable, a second end connected to the downhole tool. The cablehead further includes at least one optical fiber which transmits data between the at least one downhole tool optical fiber and the at least one wireline cable optical fiber.Type: ApplicationFiled: August 30, 2006Publication date: March 6, 2008Inventors: Kalim Ullah, Montie W. Morrison, Daniel Hogan
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Publication number: 20070272919Abstract: An organic semiconductor device including: a substrate having a first thermal expansion coefficient; and an organic semiconductor material coupled to the substrate at an interface therebetween. The organic semiconductor material includes a polymer organic semiconductor material and/or an oligomer organic semiconductor material. The organic semiconductor material also has a second thermal expansion coefficient that is different from the first thermal expansion coefficient, such that a mechanical stress is transferred from the substrate to the organic semiconductor material through the interface. This mechanical stress is related to the difference between the first and second thermal expansion coefficients and the change in temperature of the organic semiconductor device.Type: ApplicationFiled: August 4, 2006Publication date: November 29, 2007Inventors: Kiyotaka Mori, Daniel Hogan
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Patent number: 7244907Abstract: The present invention relates to optimizing optical power from a laser processing system, and more specifically to a method of optimizing the optical power by employing parallel laser processing techniques to maximize fabrication quality and yield. The method in the present invention includes the steps of: determining the specification for the final product, selecting the proper combination of optical power and processing method for processing a single feature, determining the maximum number of features in pattern to be parallel processed, selecting a portion of the desired pattern that can be parallel processed, designing the DOEs, manufacturing the DOEs, incorporating the DOE into laser processing system, operating and controlling the laser processing system, and determining if more DOEs are needed to complete the laser processing.Type: GrantFiled: June 30, 2004Date of Patent: July 17, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Daniel Hogan
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Publication number: 20060214163Abstract: A semiconductor device including: a substrate and an organic semiconductor material coupled to the substrate at an interface therebetween. The substrate has a first thermal expansion coefficient and the organic semiconductor material has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. The difference between the first thermal expansion coefficient and the second thermal expansion coefficient causes a tensile stress in a plane parallel to the interface to be transferred from the substrate to the organic semiconductor material through the interface. This tensile stress in the plane parallel to the interface causes compression of the organic semiconductor material in a direction normal to the interface.Type: ApplicationFiled: May 25, 2006Publication date: September 28, 2006Inventors: Kiyotaka Mori, Daniel Hogan
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Publication number: 20060208255Abstract: A semiconductor device and method of manufacturing the semiconductor device. The semiconductor device includes: a substrate; an organic semiconductor material coupled to the substrate at an interface therebetween; and an actuator provided for use with the substrate and/or the organic semiconductor. The actuator applies a mechanical force to the substrate and/or the organic semiconductor with which it is used when it is actuated. This mechanical force varies the carrier mobility of the organic semiconductor. The actuator is selected from the group comprising: piezoelectric actuators; piezomagnetic actuators; electrostrictive actuators; magnetostrictive actuators; electrostatic actuators; magnetostatic actuators; shape memory alloy actuators; magnetic shape memory alloy actuators; and electroactive polymer actuators.Type: ApplicationFiled: May 24, 2006Publication date: September 21, 2006Inventors: Klyotaka Mori, Daniel Hogan
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Patent number: 7040130Abstract: A microcavity forming device is provided for making microcavities in a tungsten wire. The microcavity forming device includes a source of particles; a housing for receiving a heated tungsten wire; and a plurality of jet nozzles disposed in the housing for spraying the particles toward the heated tungsten wire. The particles are 0.35–0.75 micron in diameter. The heated tungsten wire is received in the housing and the jet nozzles spray the particles toward the tungsten wire to form the microcavities in the tungsten wire.Type: GrantFiled: October 14, 2003Date of Patent: May 9, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Xinbing Liu, Ming Li, Makoto Ishizuka, Daniel Hogan, Kazuaki Ohkubo, Mitsuhiko Kimoto
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Publication number: 20060000811Abstract: A DOE array apparatus includes a plurality of different interchangeable DOEs for use with lasers in manufacturing for versatile tasks such as drilling holes or vias of various sizes and shapes and multiple ablation or material transformation patterns in a surface of an object. A method of using the apparatus in laser processing systems includes: determining a specification for the number of patterns and/or the number of layers to be patterned, designing the appropriate number of DOEs according to the product specification, assembling the DOEs into an array to be used in a laser processing system, ablating the layer on the object through laser processing, determining whether more patterns on the layer are to be processed, determining whether more layers are to be patterned, and changing and aligning the DOE for the next laser ablation or material transformation pattern to be processed.Type: ApplicationFiled: June 30, 2004Publication date: January 5, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Daniel Hogan, Xinbing Liu
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Publication number: 20060000816Abstract: A laser processing system for precision manufacturing is operated by adjusting a scan lens within the system to create a wide variety of features on a workpiece. The zoom scan lens is adjusted continuously within the system to alter radius of an annulus of the processing beam(s), resulting in change of feature size on the final workpiece. The zooming of the scan lens may be performed in combination with adjustments to the laser power and dwell time in order to maintain optimum power-per-unit area for high-quality laser processing. The invention is well-suited for drilling tapered, conical holes, such as those found in inkjet nozzles, but may be applicable for processing tapered or non-tapered features of almost any geometrical shape.Type: ApplicationFiled: June 30, 2004Publication date: January 5, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Daniel Hogan
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Publication number: 20060000815Abstract: The present invention relates to optimizing optical power from a laser processing system, and more specifically to a method of optimizing the optical power by employing parallel laser processing techniques to maximize fabrication quality and yield. The method in the present invention includes the steps of: determining the specification for the final product, selecting the proper combination of optical power and processing method for processing a single feature, determining the maximum number of features in pattern to be parallel processed, selecting a portion of the desired pattern that can be parallel processed, designing the DOEs, manufacturing the DOEs, incorporating the DOE into laser processing system, operating and controlling the laser processing system, and determining if more DOEs are needed to complete the laser processing.Type: ApplicationFiled: June 30, 2004Publication date: January 5, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Daniel Hogan
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Publication number: 20050259925Abstract: The present invention provides cells which are capable of transmitting both optical information and electrical signals when connected with each other, and a packaging system in which these cells are connected. A first connector and a second connector are formed on each cell. These two connectors are configured complementary to each other. When two cells are pressed against each other with the first connector of one of the cells facing the second connector of the other, electrical connectors engage with each other, whereby the cells are connected electrically and mechanically. A first optical device and a second optical device are also disposed in complementary positions. When the cells are connected electrically and mechanically, the tip of the first optical device and the tip of the second optical device are brought into contact with each other, allowing an optical signal to be transmitted.Type: ApplicationFiled: July 26, 2005Publication date: November 24, 2005Inventors: Takuma Asari, Daniel Hogan
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Publication number: 20050211973Abstract: A semiconductor device including an organic semiconductor material coupled to a substrate at an interface between the two components. The substrate has a first thermal expansion coefficient. The organic semiconductor material has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. A mechanical stress is transferred from the substrate to the organic semiconductor through the interface, the mechanical stress being related to the difference between the first thermal expansion coefficient and the second thermal expansion coefficient.Type: ApplicationFiled: March 23, 2004Publication date: September 29, 2005Inventors: Kiyotaka Mori, Daniel Hogan
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Patent number: 6947649Abstract: A photonic crystal comprising a waveguide made of material. The waveguide has a periodic set of holes. The material proximate to at least one of the holes in the periodic set of holes exhibits an index of refraction that has been modified by the application of laser energy relative to the material proximate to other holes in the periodic set of holes.Type: GrantFiled: December 24, 2002Date of Patent: September 20, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ming Li, Makoto Ishizuka, Xinbing Liu, Daniel Hogan
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Patent number: 6898358Abstract: A photonic crystal comprising a waveguide made of material. The waveguide has a periodic set of holes. The material proximate to at least one of the holes in the periodic set of holes exhibits an index of refraction that has been modified by the application of laser energy relative to the material proximate to other holes in the periodic set of holes. The photonic crystal is tuned to temporarily transmit a specific wavelength of light to create an on-off switch for the specific wavelength. Multiple photonic crystals are used to form a multiplexer and a demultiplexer.Type: GrantFiled: December 24, 2002Date of Patent: May 24, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ming Li, Makoto Ishizuka, Daniel Hogan, Xinbing Liu
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Publication number: 20050076689Abstract: A microcavity forming device is provided for making microcavities in a tungsten wire. The microcavity forming device includes a source of particles; a housing for receiving a heated tungsten wire; and a plurality of jet nozzles disposed in the housing for spraying the particles toward the heated tungsten wire. The particles are 0.35-0.75 micron in diameter. The heated tungsten wire is received in the housing and the jet nozzles spray the particles toward the tungsten wire to form the microcavities in the tungsten wire.Type: ApplicationFiled: October 14, 2003Publication date: April 14, 2005Inventors: Xinbing Liu, Ming Li, Makoto Ishizuka, Daniel Hogan, Kazuaki Ohkubo, Mitsuhiko Kimoto
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Patent number: 6871523Abstract: A microchannel forming device is provided for making microchannels in a wire. The microchannel forming device includes a plurality of dice for receiving a heated wire spaced along a longitudinal axis. Each die has a circumferential surface forming an opening, and teeth projecting normally from the surface and terminating in the opening. As the heated wire is drawn through the opening of each die, the teeth engage the heated wire to form longitudinal microchannels therein.Type: GrantFiled: March 31, 2003Date of Patent: March 29, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Ishizuka, Daniel Hogan, Kazuaki Ohkubo, Mitsuhiko Kimoto
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Publication number: 20040250589Abstract: A microcavity forming device is provided that includes a microcavity forming means of making microcavities in a surface of a heated filament wire. The microcavity forming means includes an array of teeth for engaging the surface along a length dimension of the filament wire. The device further includes a drawing means of drawing the filament wire along the length dimension. The drawing means draws the filament wire along the length dimension and the array of teeth engages the surface of the filament wire to form the microcavities.Type: ApplicationFiled: June 12, 2003Publication date: December 16, 2004Inventors: Daniel Hogan, Makoto Ishizuka