Patents by Inventor Daniel J. Belnap

Daniel J. Belnap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170144272
    Abstract: A method of forming a cutting element may include placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may include a cutting face area to thickness ratio ranging from 60:16 to 500:5. The polycrystalline diamond body may have at least one dimension greater than 8 mm.
    Type: Application
    Filed: September 27, 2016
    Publication date: May 25, 2017
    Inventors: Ronald K. Eyre, Daniel J. Belnap, Youhe Zhang, Yuelin Shen, Jibin Shi, Yuri Yoris Burhan
  • Patent number: 8720612
    Abstract: The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80% to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80% to less than 85%. Also included are drill bits incorporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: May 13, 2014
    Assignee: Smith International, Inc.
    Inventors: Loel G Corbett, Daniel J Belnap
  • Patent number: 6951578
    Abstract: PCD materials of this invention comprise diamond crystals that are bonded together with a catalyst/binder material. The PCD material is prepared by combining diamond grains with a catalyst/binder material either as a premixture or by infiltration during sintering. The PCD material comprises 15 percent by volume or less diamond grains sized 20 micrometers or less. The diamond grains are pressurized under elevated temperature conditions to form the desired PCD material. PCD materials of this invention can constitute the exclusive material phase of a PCD construction, or can form one or more material phase in a multi-phase material microstructure, wherein the multiple material phase can be arranged in an ordered/oriented or random fashion. PCD materials of this invention display improved properties of impact and fatigue resistance, and functional toughness, when used in complex wear environments, when compared to conventional PCs materials comprising intentionally added fine-sized diamond grains.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: October 4, 2005
    Assignee: Smith International, Inc.
    Inventors: Daniel J. Belnap, Nathan R. Anderson, Zhigang Fang, Anthony Griffo, Brian A. White