Abstract: Embodiments disclosed herein determine when a sensor of an electronic device is being used, determine if a transmitter of the electronic device is transmitting a signal, determine whether the signal has a frequency in the certain frequency bands (e.g., that cause noise at the sensor), and reduce power (e.g., perform a power back-off operation) at the transmitter if so.

Abstract: An assembly is provided that includes a printed circuit board, a transceiver integrated circuit mounted on a first surface of the printed circuit board, and an antenna module having multiple antennas and that is mounted on a second surface of the printed circuit board. The antenna module at least partially overlaps with the transceiver integrated circuit in an overlap region. The antenna module is electrically coupled to the transceiver integrated circuit via direct passthrough signal connections that extend from the first surface to the second surface. The direct passthrough signal connections are located within the overlap region. Each of the direct passthrough signal connections can be implemented using through-board stacked via structures. The antenna module can include multiple layers of signal routing lines for distributing the signals from the direct passthrough signal connections to the various antennas on the antenna module.

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.