Patents by Inventor Daniel J. Ragland

Daniel J. Ragland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953962
    Abstract: In one embodiment, a processor includes: a plurality of cores each comprising a multi-threaded core to concurrently execute a plurality of threads; and a control circuit to concurrently enable at least one of the plurality of cores to operate in a single-threaded mode and at least one other of the plurality of cores to operate in a multi-threaded mode. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Guy M. Therien, Ankush Varma, Eric J. DeHaemer, David T. Mayo, Ariel Gur, Yoav Ben-Raphael, Mark P. Seconi
  • Patent number: 11892969
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: February 6, 2024
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Guy M. Therien, Kirk Pfaender
  • Publication number: 20230418622
    Abstract: Systems, apparatus, articles of manufacture, and methods to perform cloud-based artificial intelligence overclocking are disclosed that, collect workload information, the workload information representing a workload to be executed by the first compute platform, cause generation of an output from an AI model based on the workload information, the output representing an overclocking frequency value to be used for operation of the first compute platform, and performing overclocking based on the overclocking frequency value.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 28, 2023
    Inventors: Xia Zhu, Jianfang Zhu, Taeyoung Kim, Daniel J. Ragland, Rodny Rodriguez, Louis Draghi, Matthew Paul Fife, Jason Xili Xie
  • Publication number: 20230131521
    Abstract: In one embodiment, a processor includes: a plurality of cores each comprising a multi-threaded core to concurrently execute a plurality of threads; and a control circuit to concurrently enable at least one of the plurality of cores to operate in a single-threaded mode and at least one other of the plurality of cores to operate in a multi-threaded mode. Other embodiments are described and claimed.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 27, 2023
    Inventors: Daniel J. Ragland, Guy M. Therien, Ankush Varma, Eric J. DeHaemer, David T. Mayo, Ariel Gur, Yoav Ben-Raphael, Mark P. Seconi
  • Patent number: 11579944
    Abstract: In one embodiment, a processor includes: a plurality of cores each comprising a multi-threaded core to concurrently execute a plurality of threads; and a control circuit to concurrently enable at least one of the plurality of cores to operate in a single-threaded mode and at least one other of the plurality of cores to operate in a multi-threaded mode. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Guy M. Therien, Ankush Varma, Eric J. DeHaemer, David T. Mayo, Ariel Gur, Yoav Ben-Raphael, Mark P. Seconi
  • Publication number: 20220114134
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: DANIEL J. RAGLAND, GUY M. THERIEN, KIRK PFAENDER
  • Patent number: 11216409
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Guy M. Therien, Kirk Pfaender
  • Patent number: 10963028
    Abstract: According to one embodiment of the invention, a processor includes a power control unit, an interface to software during runtime that permits the software to set a plurality of power management constraint parameters for the power control unit during runtime of the processor without a reboot of the processor, and a storage element to store a respective lock bit for each of the plurality of power management constraint parameters to disable the interface from changing a respective constraint parameter when set.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 30, 2021
    Assignee: Intel Corporation
    Inventors: Ryan D. Wells, Sanjeev S. Jahagirdar, Inder M. Sodhi, Jeremy J. Shrall, Stephen H. Gunther, Daniel J. Ragland, Nicholas J. Adams
  • Patent number: 10958278
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, and systems for phase-lock loop (PLL) configuration and realization to provide various reference clock frequencies to computing core(s) and processor(s), and other benefits. A post digitally-controlled oscillator (DCO) divider (PDIV) of the PLL may be configured with a dedicated PDIV threshold value corresponding to a dedicated target reference frequency.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Ariel Gur, Daniel J. Ragland, Yoav Ben-Raphael, Ernest Knoll
  • Publication number: 20210036708
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, and systems for phase-lock loop (PLL) configuration and realization to provide various reference clock frequencies to computing core(s) and processor(s), and other benefits. A post digitally-controlled oscillator (DCO) divider (PDIV) of the PLL may be configured with a dedicated PDIV threshold value corresponding to a dedicated target reference frequency.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 4, 2021
    Inventors: Ariel Gur, Daniel J. Ragland, Yoav Ben-Raphael, Ernest Knoll
  • Publication number: 20210004348
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: DANIEL J. RAGLAND, GUY M. THERIEN, KIRK PFAENDER
  • Publication number: 20200363104
    Abstract: In one embodiment, a computing device includes a processor, a water block, a thermoelectric cooler, and a thermal space transformer. The thermoelectric cooler is disposed in series between the processor and the water block, and the thermoelectric cooler includes a heated surface and a cooled surface. The heated surface is thermally coupled to the water block, and the cooled surface is thermally coupled to the processor via the thermal space transformer. The thermal space transformer transfers thermal energy between the processor and the cooled surface of the thermoelectric cooler. The thermal space transformer includes a smaller surface and a larger surface. The smaller surface is thermally coupled to the processor and the larger surface is thermally coupled to the cooled surface of the thermoelectric cooler.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Applicant: Intel Corporation
    Inventors: Mark MacDonald, Akhilesh P. Rallabandi, Genevieve L. Gaudin, Daniel J. Ragland, Rodny Rodriguez, Felipe Gonzalez, Hui Xiong, Sai Goutham Ponnada, Christoph Jechlitschek
  • Patent number: 10796977
    Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: John Fallin, Daniel J. Ragland, Jonathan P. Douglas
  • Patent number: 10783110
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 22, 2020
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Guy M. Therien, Kirk Pfaender
  • Publication number: 20200286804
    Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 10, 2020
    Inventors: John FALLIN, Daniel J. RAGLAND, Jonathan P. DOUGLAS
  • Publication number: 20200133813
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a system condition engine and non-volatile memory. The system condition engine is configured to monitor a condition associated with an electronic device and non-volatile memory. The non-volatile memory can store a predetermined specification range or a specification threshold for the condition and when the condition is outside of the predetermined specification range or exceeds the specification threshold, the system condition engine can record that the condition was outside of the predetermined specification range or exceeded the specification threshold in the non-volatile memory. In an example, the non-volatile memory may be a fuse, especially a field programmable fuse.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: Intel Corporation
    Inventors: Robert Forrest Kwasnick, Daniel J. Ragland
  • Patent number: 10579125
    Abstract: An integrated circuit of an aspect includes a power control unit having an interface to receive an indication that one or more instructions of a first type are to be performed by a core. The power control unit also has logic to control a maximum clock frequency for the core based on the indication that the instructions of the first type are to be performed by the core.
    Type: Grant
    Filed: February 27, 2016
    Date of Patent: March 3, 2020
    Assignee: Intel Corporation
    Inventors: Daniel J. Ragland, Pavithra Sampath, Kirk Pfaender, Kahraman D. Akdemir, Ariel Gur
  • Publication number: 20190171270
    Abstract: According to one embodiment of the invention, a processor includes a power control unit, an interface to software during runtime that permits the software to set a plurality of power management constraint parameters for the power control unit during runtime of the processor without a reboot of the processor, and a storage element to store a respective lock bit for each of the plurality of power management constraint parameters to disable the interface from changing a respective constraint parameter when set.
    Type: Application
    Filed: November 26, 2018
    Publication date: June 6, 2019
    Inventors: Ryan D. Wells, Sanjeev S. Jahagirdar, Inder M. Sodhi, Jeremy J. Shrall, Stephen H. Gunther, Daniel J. Ragland, Nicholas J. Adams
  • Publication number: 20190079806
    Abstract: In one embodiment, a processor includes: a plurality of cores each comprising a multi-threaded core to concurrently execute a plurality of threads; and a control circuit to concurrently enable at least one of the plurality of cores to operate in a single-threaded mode and at least one other of the plurality of cores to operate in a multi-threaded mode. Other embodiments are described and claimed.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 14, 2019
    Inventors: Daniel J. Ragland, Guy M. Therien, Ankush Varma, Eric J. DeHaemer, David T. Mayo, Ariel Gur, Yoav Ben-Raphael, Mark P. Seconi
  • Publication number: 20190004993
    Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 3, 2018
    Publication date: January 3, 2019
    Inventors: DANIEL J. RAGLAND, GUY M. THERIEN, KIRK PFAENDER