Abstract: A baling machine includes a gathering chamber and a baling chamber. The gathering chamber includes a charging inlet through which material to be baled is delivered into the gathering chamber. The baling chamber communicates with the gathering chamber to allow compressed material to be forced from the gathering chamber into the baling chamber against the end wall. The baling chamber has a discharge outlet at one side for ejection of compressed material from the baling chamber. A gathering ram is reciprocal within the gathering chamber. The gathering ram includes a ram head movable between a retracted position and an advanced position to compress material in the gathering chamber and to drive compressed material into the baling chamber. An ejection ram is reciprocal within the baling chamber. The ejection ram includes a main ram head and an auxiliary ram head adjacent to each other.

Abstract: A continuous extrusion type reciprocating baling apparatus includes an end pad insertion mechanism which permits end pads to be automatically inserted into the baling chamber at each end of the bale. The end pad insertion mechanism works in conjunction with a bale tying apparatus so that end pads can be provided on each end of automatically tied bales. The end pad insertion mechanism is located above the baling chamber so that end pads are inserted downwardly into the baling chamber, to permit the typing apparatus to be provided on each side of the baler. The end pad insertion mechanism includes an enclosure for containing a supply of end pads and a plate to push the end pads downwardly through a slot provided in the baling chamber.

Abstract: The present invention discloses a device for positioning a multi-planar or multi-leaded surface mount electronic component on a printed circuit board (PCB) during reflow soldering. By design this non-conductive device made of thermoplastic resins comprises a fence, having a cavity, wherein the electronic component is positioned relative to printed circuit board foot print contacts. Attached to the bottom surface of the fence is a pair of collapsible slotted pegs. These pegs extend vertically downward from the fence and are adapted to provide a snap-fit insertion and retention mechanism whereby the fence is held in place by inserting the collapsible pegs into holes in a printed circuit board. Thereafter, a pair of cantilever beams which are attached to the fence sidewalls and extend into the fence cavity, make contact with the electronic component. As the fence is inserted into the printed circuit board, the cantilever beams press and hold the electronic component in place during reflow soldering.