Abstract: A component alignment and transfer apparatus is disclosed which includes an accumulator for accumulating and aligning a plurality of components and a transfer head for transferring the accumulated and aligned components from the accumulator to a collection receptacle. The transfer head includes a scissor mechanism having a plurality of sections, with each section including a pair of scissor arms intersecting at a pivot point and a suction pickup. The plurality of sections are pivotally connected to form an elongated transfer head movable between a first position having a first spacing between suction pickups and a second position having a second spacing between suction pickups. An actuator is connected to move the suction pickups between the first position and the second position.

Abstract: A method of mounting an integrated circuit carrier (10) having a plurality of straight leads (12) retained by an integral frame (16) is provided. The plurality of straight leads (12) of the carrier (10) is bent to form a plurality of bent leads (12) still retained by the frame (16). The plurality of bent leads are then scored to form a notch (32) on each bent lead. Solder fluxing, placing, and reflowing the plurality of bent leads of the integrated circuit carrier against corresponding printed lines of the printed circuit (26) surface before each notch follow. Finally, a remainder portion of the plurality of leads from and including the frame (16) to the notch (32) on each lead (12) is removed.