Patents by Inventor DANIEL KAPPAUF

DANIEL KAPPAUF has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915990
    Abstract: In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: February 27, 2024
    Assignee: Siemens Aktiengesellschaft
    Inventors: Daniel Kappauf, Stanislav Panicerski, Jens Schmenger
  • Patent number: 11832425
    Abstract: A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: November 28, 2023
    Assignee: Siemens Aktiengesellschaft
    Inventors: Daniel Kappauf, Lutz Namyslo
  • Publication number: 20230131848
    Abstract: In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.
    Type: Application
    Filed: January 14, 2021
    Publication date: April 27, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: DANIEL KAPPAUF, STANISLAV PANICERSKI, JENS SCHMENGER
  • Publication number: 20220361360
    Abstract: A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.
    Type: Application
    Filed: August 21, 2020
    Publication date: November 10, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: DANIEL KAPPAUF, LUTZ NAMYSLO
  • Publication number: 20220059426
    Abstract: A power module unit, in particular for a frequency converter, includes a base plate having a first side provided with a recess and a second side, a cooling fin fastened in the recess of the base plate at least in one region by a positive fit, a material fit, and/or a non-positive fit, and a substrate provided for a power semiconductor and disposed on the second side of the base plate.
    Type: Application
    Filed: July 3, 2019
    Publication date: February 24, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: DANIEL KAPPAUF, STANISLAV PANICERSKI, JENS SCHMENGER, ROBERT GOSPOS, CHRISTIAN KNEUER, MATTHIAS NÄHRIG