Patents by Inventor Daniel Kavaldjiev
Daniel Kavaldjiev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8520208Abstract: A polarizing device may be used with sample inspection system having one or more collection systems that receive scattered radiation from a region on a sample surface and direct it to a detector. The polarizing device disposed between the collection system(s) and the detector. The polarizing device may include a plurality of polarizing sections. The sections may be characterized by different polarization characteristics. The polarizing device is configured to transmit scattered radiation from defects to the detector and to block noise from background sources that do not share characteristics with scattered radiation from the defects from reaching the detector while maximizing a capture rate for the defects the detector at a less than optimal signal-to-noise ratio.Type: GrantFiled: March 23, 2012Date of Patent: August 27, 2013Assignee: KLA-Tencor CorporationInventors: Stephen Biellak, Daniel Kavaldjiev
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Patent number: 8494802Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.Type: GrantFiled: June 19, 2009Date of Patent: July 23, 2013Assignee: KLA-Tencor Corp.Inventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
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Publication number: 20130016346Abstract: Systems configured to inspect a wafer are provided.Type: ApplicationFiled: July 9, 2012Publication date: January 17, 2013Applicant: KLA-TENCOR CORPORATIONInventors: Anatoly Romanovsky, Ivan Maleev, Daniel Kavaldjiev, Yury Yuditsky, Dirk Woll, Stephen Biellak
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Patent number: 8294887Abstract: An inspection system may include, but is not limited to: an illumination subsystem for directing light to an inspection specimen comprising: a power attenuator subsystem configured for altering the power level of a light beam emitted by the illumination subsystem; and a power attenuation control subsystem configured to provide control signals to the power attenuator subsystem according to a detected level of light scattering by the inspection specimen upon illumination by the illumination subsystem. A method for scatterometry inspection may include, but is not limited to: directing light having a power level to an inspection specimen from a light source; detecting light scattered from the specimen; and modifying a power level of one or more intermediate light beams within the light source according to a level of light scattering by the specimen upon illumination by the light source.Type: GrantFiled: July 22, 2010Date of Patent: October 23, 2012Assignee: KLA-Tencor CorporationInventors: Stephen Biellak, Daniel Kavaldjiev, George J. Kren, Anatoly Romanovsky, Christian Wolters
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Patent number: 8269960Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.Type: GrantFiled: July 24, 2008Date of Patent: September 18, 2012Assignee: KLA-Tencor Corp.Inventors: Juergen Reich, Louis Vintro, Prasanna Dighe, Andrew Steinbach, Daniel Kavaldjiev, Stephen Biellak
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Patent number: 8169613Abstract: A polarizing device may be used with sample inspection system having one or more collection systems that receive scattered radiation from a region on a sample surface and direct it to a detector. The polarizing device disposed between the collection system(s) and the detector. The polarizing device may include a plurality of polarizing sections. The sections may be characterized by different polarization characteristics. The polarizing device is configured to transmit scattered radiation from defects to the detector and to block noise from background sources that do not share characteristics with scattered radiation from the defects from reaching the detector while, maximizing a capture rate for the defects the detector at a less than optimal signal-to-noise ratio.Type: GrantFiled: November 13, 2009Date of Patent: May 1, 2012Assignee: KLA-Tencor Corp.Inventors: Stephen Biellak, Daniel Kavaldjiev
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Patent number: 8134698Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a scattered radiation collecting assembly that collects radiation scattered from the surface. The radiation targeting assembly generates primary and secondary beams. Data collected from the reflections of the primary and secondary beams may be used in a dynamic range extension routine, alone or in combination with a power attenuation routine.Type: GrantFiled: March 14, 2008Date of Patent: March 13, 2012Assignee: KLA-Tencor CorporationInventors: Christian Wolters, Anatoly Romanovsky, Daniel Kavaldjiev, Bret Whiteside
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Patent number: 8068234Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: GrantFiled: February 18, 2009Date of Patent: November 29, 2011Assignee: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Publication number: 20110196639Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.Type: ApplicationFiled: June 19, 2009Publication date: August 11, 2011Applicant: Kla-Tencor CorporationInventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
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Patent number: 7912658Abstract: Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.Type: GrantFiled: May 28, 2008Date of Patent: March 22, 2011Assignee: KLA-Tencor Corp.Inventors: Stephen Biellak, Daniel Kavaldjiev
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Publication number: 20100208272Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: ApplicationFiled: February 18, 2009Publication date: August 19, 2010Applicant: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Publication number: 20100060888Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.Type: ApplicationFiled: July 24, 2008Publication date: March 11, 2010Applicant: KLA-TENCOR CORPORATIONInventors: Juergen Reich, Louis Vintro, Prasanna Dighe, Andrew Steinbach, Daniel Kavaldjiev, Stephen Biellak
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Publication number: 20090299655Abstract: Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.Type: ApplicationFiled: May 28, 2008Publication date: December 3, 2009Inventors: Stephen Biellak, Daniel Kavaldjiev
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Patent number: 7528944Abstract: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.Type: GrantFiled: May 22, 2007Date of Patent: May 5, 2009Assignee: KLA-Tencor Technologies CorporationInventors: David Chen, Andrew Steinbach, Daniel Kavaldjiev, Alexander Belyaev, Juergen Reich
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Patent number: 7436505Abstract: Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.Type: GrantFiled: April 4, 2006Date of Patent: October 14, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Alexander Belyaev, Daniel Kavaldjiev, Amith Murali, Aleksey Petrenko, Mike D. Kirk, David Shortt, Brian L. Haas, Kurt L. Haller
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Publication number: 20080018887Abstract: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.Type: ApplicationFiled: May 22, 2007Publication date: January 24, 2008Inventors: David Chen, Andrew Steinbach, Daniel Kavaldjiev, Alexander Belyaev, Juergen Reich
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Publication number: 20070229809Abstract: Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.Type: ApplicationFiled: April 4, 2006Publication date: October 4, 2007Applicant: KLA-Tencor Technologies Corp.Inventors: Alexander Belyaev, Daniel Kavaldjiev, Amith Murali, Aleksey Petrenko, Mike Kirk, David Shortt, Brian Haas, Kurt Haller
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Patent number: 7173715Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.Type: GrantFiled: July 12, 2005Date of Patent: February 6, 2007Assignee: KLA-Tencor CorporationInventors: Dieter Mueller, Rainer Schierle, Daniel Kavaldjiev
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Publication number: 20060232770Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: March 1, 2006Publication date: October 19, 2006Inventors: Paul Sullivan, George Kren, Rodney Smedt, Hans Hansen, David Shortt, Daniel Kavaldjiev, Christopher Bevis
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Publication number: 20060126076Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.Type: ApplicationFiled: July 12, 2005Publication date: June 15, 2006Applicant: KLA-Tencor CorporationInventors: Dieter Mueller, Rainer Schierle, Daniel Kavaldjiev