Abstract: The present invention relates to a centrifuge, in particular a laboratory centrifuge, comprising a rotor which is rotatably mounted in an interior of a rotor chamber and is designed to accommodate sample vessels, a drive motor to set the rotor in rotation, and a cooling device which is designed to dissipate heat from the interior of the rotor chamber via a coolant, the cooling device being designed to use an elastocaloric effect and having at least one cooling unit which comprises an elastocaloric material arranged between a counter block and a punch, the punch being designed to periodically apply a force to the elastocaloric material and then to let the elastocaloric material relax again, the cooling device being designed to transfer both heat from the elastocaloric material to the coolant and from the coolant to the elastocaloric material. The present invention also relates to a method for cooling an interior of a rotor chamber of such a centrifuge.

Abstract: The present invention relates to the latching closed of doors on appliances. In particular, the present invention provides an advantageous apparatus for locking the lid of a centrifuge. Apparatus for locking an appliance door in a closed position, the apparatus comprises: a locking member for attachment to a door, the locking member having an engagement section; a locking bolt for engaging the engagement section in the locking member; a linear actuator for moving the locking bolt along an axis, wherein the linear actuator is self-locking.

Abstract: A method for fabricating a SiC power semiconductor device includes: providing a SiC power semiconductor die; depositing a metallization layer over the power semiconductor die, the metallization layer including a first metal; arranging the power semiconductor die over a die carrier such that the metallization layer faces the die carrier, the die carrier being at least partially covered by a plating that includes Ni; and diffusion soldering the power semiconductor die to the die carrier such that a first intermetallic compound is formed between the power semiconductor die and the plating, the first intermetallic compound including Ni3Sn4.

Abstract: The application relates to a cooling system, the cooling system having: an evaporator, a first compressor, a second compressor, a cooling component, an expansion device and a line system that connects the evaporator, the first compressor, the second compressor, the cooling component and the expansion device to one another. The cooling system includes a refrigerant, wherein the refrigerant comprises carbon dioxide. The first compressor and the second compressor are arranged in series with one another. The application also relates to a corresponding laboratory instrument.

Abstract: The present invention relates to a centrifuge, in particular a laboratory centrifuge, comprising a rotor which is rotatably mounted in an interior of a rotor chamber and is designed to accommodate sample vessels, a drive motor to set the rotor in rotation, and a cooling device which is designed to dissipate heat from the interior of the rotor chamber via a coolant, the cooling device being designed to use an elastocaloric effect and having at least one cooling unit which comprises an elastocaloric material arranged between a counter block and a punch, the punch being designed to periodically apply a force to the elastocaloric material and then to let the elastocaloric material relax again, the cooling device being designed to transfer both heat from the elastocaloric material to the coolant and from the coolant to the elastocaloric material. The present invention also relates to a method for cooling an interior of a rotor chamber of such a centrifuge.