Abstract: A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Abstract: A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Abstract: A first oscillator signal and a second oscillator signal are transmitted to a processing unit. The first oscillator signal has a finite frequency or phase offset relative to the second oscillator signal. A first clock signal that is derived from the first oscillator signal is selected as a primary clock to clock the processing unit. A second clock signal derived from the second oscillator signal is aligned to the first clock signal. If a fault is detected on the first clock signal, the second clock signal is selected as the primary clock to clock the processing unit. Upon being selected as the primary clock, the phase of the second is stretched by one fixed phase for one clock cycle.

Abstract: Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

Abstract: A high-speed voltage clamping circuit includes p-type field effect transistor (PFET) biasing circuit, an n-type field effect transistor (NFET) biasing circuit, and a field effect transistor (FET) clamp circuit. The PFET biasing circuit is configured to generate a PFET biasing voltage. The NFET biasing circuit is configured to generate a NFET biasing voltage. The FET clamp circuit is in signal communication with the PFET biasing circuit and the NFET biasing circuit. The PFET biasing circuit controls operation of the clamping circuit in response to a voltage overshoot event and the NFET biasing circuit controls operation of the clamping circuit in response to a voltage undershoot event.

Abstract: A high-speed voltage clamping circuit includes p-type field effect transistor (PFET) biasing circuit, an n-type field effect transistor (NFET) biasing circuit, and a field effect transistor (FET) clamp circuit. The PFET biasing circuit is configured to generate a PFET biasing voltage. The NFET biasing circuit is configured to generate a NFET biasing voltage. The FET clamp circuit is in signal communication with the PFET biasing circuit and the NFET biasing circuit. The PFET biasing circuit controls operation of the clamping circuit in response to a voltage overshoot event and the NFET biasing circuit controls operation of the clamping circuit in response to a voltage undershoot event.

Abstract: A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Abstract: A method includes determining a phase error for a first clock signal and a second clock signal and determining an offset based on the phase error for the first clock signal and the second clock signal. The method also includes adding the offset to a phase of the first clock signal to produce a first adjusted clock signal and subtracting the offset from a phase of the second clock signal to produce a second adjusted clock signal. A phase error for the first adjusted clock signal and the second adjusted clock signal is smaller than the phase error for the first clock signal and the second clock signal.

Abstract: A first oscillator signal and a second oscillator signal are transmitted to a processing unit. The first oscillator signal has a finite frequency or phase offset relative to the second oscillator signal. A first clock signal that is derived from the first oscillator signal is selected as a primary clock to clock the processing unit. A second clock signal derived from the second oscillator signal is aligned to the first clock signal. If a fault is detected on the first clock signal, the second clock signal is selected as the primary clock to clock the processing unit. Upon being selected as the primary clock, the phase of the second is stretched by one fixed phase for one clock cycle.

Abstract: A method includes connecting inputs of a first plurality of interpolation branches to a first clock signal, connecting inputs of a second plurality of interpolation branches to a second clock signal, and connecting inputs of a third plurality of interpolation branches to a third clock signal. The method also includes combining outputs of the first plurality of interpolation branches, the second plurality of interpolation branches, and the third plurality of interpolation branches to produce an output clock signal and adjusting a phase of the output clock signal by connecting an input of an interpolation branch of the third plurality of interpolation branches to the second clock signal.

Abstract: A method includes connecting inputs of a first plurality of interpolation branches to a first clock signal, connecting inputs of a second plurality of interpolation branches to a second clock signal, and connecting inputs of a third plurality of interpolation branches to a third clock signal. The method also includes combining outputs of the first plurality of interpolation branches, the second plurality of interpolation branches, and the third plurality of interpolation branches to produce an output clock signal and adjusting a phase of the output clock signal by connecting an input of an interpolation branch of the third plurality of interpolation branches to the second clock signal.

Abstract: A method includes determining a phase error for a first clock signal and a second clock signal and determining an offset based on the phase error for the first clock signal and the second clock signal. The method also includes adding the offset to a phase of the first clock signal to produce a first adjusted clock signal and subtracting the offset from a phase of the second clock signal to produce a second adjusted clock signal. A phase error for the first adjusted clock signal and the second adjusted clock signal is smaller than the phase error for the first clock signal and the second clock signal.

Abstract: Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Abstract: A printed circuit board (‘PCB’) including a substrate integrated waveguide (‘SIW’) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.

Abstract: A computer controls voltage supply for a system that includes a plurality of active cables. The computer determines that a first voltage source included in a first cable has failed to provide a required amount of voltage to the first cable. The computer switches the first cable to a second voltage source included in a second cable. The second voltage source provides voltage to the first cable.

Abstract: According to one aspect of the present disclosure a method and technique for managing data transfer includes receiving and storing a plurality of different data patterns anticipated to be encountered by a processor unit of a data processing system corresponding to a particular application being processed. Responsive to receiving a read request for data, the requested data is read from a memory subsystem, and the read data is compared by the memory subsystem to the stored data patterns. Responsive to determining that the read data matches at least one of the stored data patterns, the memory subsystem replaces the matching read data with a pattern tag corresponding to the matching data pattern. The pattern tag is transmitted over a communication link in response to the request.

Abstract: A computer uses an active cable architecture to control communications. The computer sends a first set of instructions for completion of an activity to a first micro-controller of an active communication cable. The computer determines that at least one transceiver of an active cable is to receive a set of signals from the first micro-controller. The computer forms a communication connection between the first micro-controller and the at least one transceiver. The computer sends a second set of instructions to the at least one transceiver, wherein the second set of instructions instruct the at least one transceiver to complete at least a portion of the activity.

Abstract: Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.

Abstract: An electronic package including modulated mesh planes can reduce crosstalk between adjacent signal wires. Modulated mesh planes above and below a wiring plane include sets of adjacent wires arranged parallel to signal wires within the wiring plane, and sets of adjacent wires arranged perpendicular to the signal wires. The wires in each of the mesh planes are electrically interconnected and insulated from the signal wires by a dielectric layer. The electronic package also includes a region of the mesh planes having the adjacent wires that are perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance. A set of rectangular mesh areas of the mesh planes can be populated with supplemental wires and via interconnect structures which can further reduce crosstalk.

Abstract: An input/output (I/O) interface of a die is disclosed. The I/O interface of the die includes a first region of a backside of the die. The I/O interface further includes a second region of the backside surface of the die positioned along at least a portion of a perimeter of the first region. The second region provides power and ground connections to the first region.