Patents by Inventor Daniel M. Myers, JR.

Daniel M. Myers, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170203386
    Abstract: The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).
    Type: Application
    Filed: January 13, 2017
    Publication date: July 20, 2017
    Inventors: Gen Satoh, Daniel M. Myers, Jr., Brandon H. Bodily
  • Publication number: 20170203355
    Abstract: Generally, the present disclosure is directed various embodiments to additively manufacture AM preforms to reduce, prevent, and/or eliminate defects that occur in post processing operations (e.g. forging, shot peening, machining, or other post processing operations).
    Type: Application
    Filed: January 17, 2017
    Publication date: July 20, 2017
    Inventors: Gen Satoh, Daniel M. Myers, JR., Brandon H. Bodily