Abstract: An automated system cleans trays used in handling circuit device packages is provided in a sequential manner with pressurized air in a cleaning chamber, and a vacuum system is operated to remove the contamination (e.g. metal fibers) from the cleaning chamber. The system can convey trays in a sequential manner from one or more stacks of trays at associated tray loading stations into one or more associated cleaning chambers, and convey the cleaned trays from the one or more cleaning chambers to one or more associated tray unloading stations, where the cleaned trays are stacked. The system can handle approximately 30,000 trays per day.

Abstract: An automated method of cleaning trays used in handling circuit device packages includes the steps of: placing a plurality of trays on a tray loading station of an automated tray cleaning machine; lowering in an automated manner a first tray of the plurality of trays onto a conveyor; conveying in an automated manner the first tray from the tray loading station into a cleaning chamber; automatically applying pressurized air in the cleaning chamber to one or more surfaces of the first tray to remove debris from the first tray; conveying in an automated manner the first tray out of the cleaning chamber and to a tray unloading station; and raising in an automated manner the first tray above the conveyor.

Abstract: A cassette magazine for thin semiconductor wafers comprises first and second sidewalls, one or more rods or plates coupling the first and second sidewalls to one another, and a plurality of slot supports configured to support sides of the thin semiconductor wafers extending inward from both the first sidewall and the second sidewall, the plurality of slot supports having widths sufficient to cause a distance by which centers of the thin semiconductor wafers sag to be less than about 0.3 cm when the thin semiconductor wafers have thicknesses of about 100 ?m and diameters of 200 mm.

Abstract: An automatic drilling equipment for drilling notches in a plurality of trays includes a drilling tool and a tray base to hold and move a plurality of trays on the tray base with respect to the drilling tool. The drilling tool is operable to drill the plurality of trays to simultaneously open a notch at the same position in each tray of the plurality of trays.

Abstract: Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.

Abstract: Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.

Abstract: Method and device for improved die bonding. In some embodiments, a bonding device includes a heating element configured to heat air. The bonding device also includes an application element having a plurality of holes configured to apply the heated air to a die, the application element is characterized by an arrangement of the plurality of holes that satisfies one or more directionality criteria. The bonding device further includes a controller configured to control the heating element and to set the temperature of the heated air expelled through the plurality of holes of the application element in order to satisfy one or more bonding criteria.

Abstract: Method and device for improved die bonding. In some embodiments, a bonding device includes a heating element configured to heat air. The bonding device also includes an application element having a plurality of holes configured to apply the heated air to a die, the application element is characterized by an arrangement of the plurality of holes that satisfies one or more directionality criteria. The bonding device further includes a controller configured to control the heating element and to set the temperature of the heated air expelled through the plurality of holes of the application element in order to satisfy one or more bonding criteria.