Patents by Inventor Daniel P. Buergi

Daniel P. Buergi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
    Patent number: 11011493
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 18, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ai Jun Song, Daniel P. Buergi, Horst Clauberg, Matthew E. Tarabulski, Matthew B. Wasserman
  • Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
    Patent number: 10468373
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: November 5, 2019
    Assignee: Kulicke and Sofia Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Daniel P. Buergi, Horst Claubeg, Matthew B. Wasserman
  • BONDING AND PLACEMENT TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS
    Publication number: 20190164931
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.
    Type: Application
    Filed: October 3, 2018
    Publication date: May 30, 2019
    Inventors: Ai Jun Song, Daniel P. Buergi, Horst Clauberg, Matthew E. Tarabulski, Matthew B. Wasserman
  • Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
    Patent number: 10245668
    Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 2, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventors: Daniel P. Buergi, Thomas J. Colosimo, Jr., Edward T. Laurent, Michael P. Schmidt-Lange
  • BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPERATING BONDING MACHINES, AND TECHNIQUES FOR IMPROVING UPH ON SUCH BONDING MACHINES
    Publication number: 20180174997
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Application
    Filed: February 19, 2018
    Publication date: June 21, 2018
    Inventors: Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Claubeg, Matthew B. Wasserman
  • FLUXING SYSTEMS, BONDING MACHINES INCLUDING FLUXING SYSTEMS, AND METHODS OF OPERATING THE SAME
    Publication number: 20180117695
    Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 3, 2018
    Inventors: Daniel P. Buergi, Thomas J. Colosimo, JR., Edward T. Laurent, Michael P. Schmidt-Lange
  • Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
    Patent number: 9929121
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 27, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Daniel P. Buergi, Horst Clauberg, Matthew B. Wasserman
  • BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPERATING BONDING MACHINES, AND TECHNIQUES FOR IMPROVING UPH ON SUCH BONDING MACHINES
    Publication number: 20170062378
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Application
    Filed: August 4, 2016
    Publication date: March 2, 2017
    Inventors: Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Clauberg, Matthew B. Wasserman