Patents by Inventor Daniel P. Feeney

Daniel P. Feeney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Quantum molecular based thermal interface material
    Patent number: 10388587
    Abstract: A thermal interface structure includes a first surface including a surface of a heat generating device, a first surface binding polymer bonded to the first surface, a second surface including a surface of a heat sink, and a second surface binding polymer bonded to the second surface. The first surface binding polymer and the second surface binding polymer cross-link to one another to form a covalently bonded, cross-linked section that creates a thermal interface material that forms a continuous molecular connection between the first surface and the second surface.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: August 20, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: David R. Smith, William C. Mollberg, Daniel P. Feeney, Ky Mickelsen