Patents by Inventor Daniel R. Boudreault

Daniel R. Boudreault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermocouples with two tabs spaced apart along a transverse axis and methods
    Patent number: 8821013
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: September 2, 2014
    Assignee: Corning Incorporated
    Inventors: Daniel R Boudreault, Kenneth P Ehrlich, David D Rye
  • THERMOCOUPLES WITH TWO TABS SPACED APART ALONG A TRANSVERSE AXIS AND METHODS
    Publication number: 20120106594
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Application
    Filed: May 12, 2011
    Publication date: May 3, 2012
    Inventors: Daniel R. Boudreault, Kenneth P. Ehrlich, David D. Rye