Abstract: The present invention is a means and a method for manufacturing large three dimensional memory arrays. The present invention is a means and a method for addressing the WL and BL resistance by creating arrays having not only large plane conductors for each of the memory layers (WLs) but also for the opposite polarity common layer (BL). The present invention is also a means and a method to form via interconnections between the substrate logic and the respective layers of a multidimensional array. The present invention is also a way to operate an array in which the select device is unipolar but the array is above to be operated in a bipolar way. This facilitates a bipolar operation for memory cell technologies such as Resistive RAM (e.g., RRAM, ReRAM and Memresistors).

Abstract: Electronic memory circuits, and more particularly, low power electronic memory circuits having low manufacturing costs are disclosed. The present invention is a circuit design that utilizes two transistor types—bipolar and MOS (but, not both NMOS and PMOS) one of which can be manufactured together with the memory cell's non-linear conductive elements (such as a diode) thereby reducing the number of processing steps and masks and resulting in lower cost.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F.sup.2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: In various embodiments, a memory storage element for storing two or more bits of information is formed by connecting two resistive change elements in series whereby the first resistive change element is made of a first material and the second resistive change element is made of a second material and the melting point of the first resistive change element material is greater than the melting point of the second resistive change element material such that the set and reset states of the two elements can be written and read.

Abstract: A device and method for incrementally updating the error detecting and correcting bits for an error corrected block of data in a cross point memory array is disclosed. When an error corrected block of data is modified, only the modified data bits and the incrementally updated error detecting and correcting bits are changed in the cross point memory device for improved performant and reduced impact to device endurance.

Abstract: In various embodiments, a memory cell for storing two or more bits of information includes two series-connected memory storage elements composed of programmable materials having different melting points, enabling independent programming of the storage elements via different current pulses.

Abstract: The present invention is a means and a method for speeding up the fabrication process, lowering the cost and improving yields. The present invention is a method for manufacturing memory cells in a diode memory array by utilizing selective epitaxial growth techniques to form high quality silicon for diodes and then lesser quality silicon to fill recesses and prepare the surface for subsequent planarization or etching steps.

Abstract: The present invention is a method for accessing more than one block of correctable information at a time when it is most efficient to access more bits of information at a time on a given dimension, for example from a multiple bit per cell (MLC) memory element, than the error correction algorithm can correct. Since it may be more efficient to access more bits of information at a time on a given dimension than the error correction algorithm can correct, that access is performed in this most efficient way, but the information is divided into correctable blocks within this information such that the error correction algorithm can still compensate for a serious fault along a given dimension. Furthermore, the present invention can be employed even when the number of bits retrieved along a given dimension is less than the number of correctable bits when it is desired to protect against a given number of faults which could, in total, exceed the number of correctable bits.

Abstract: The present invention is a method for forming a vertically oriented element having a narrower area near its center away from either end. The present invention will find applicability in other memory cell structures. The element will have a narrow portion towards its center such that current density will be higher away from the ends of the element. In this way, the heating will occur away from the ends of the storage element. Heating in a phase-change or resistive change element leads to end of life conditions, including the condition whereby contaminants from the end point contacts are enabled to migrate away from the end point and into the storage element thereby contaminating the storage element material and reducing its ability to be programmed, erased and/or read back.

Abstract: The present invention relates to electronic memory circuits, and more particularly, to low power electronic memory circuits having low manufacturing costs. The present invention is a circuit design that utilizes two transistor types—bipolar and MOS (but, not both NMOS and PMOS) one of which can be manufactured together with the memory cell's non-linear conductive elements (such as a diode) thereby reducing the number of processing steps and masks and resulting in lower cost.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: The present invention is a means and method for constructing and operating a 3-D array and, more particularly, a 3-D memory array. This array can be manufactured as a monolithic integrated circuit at low cost by virtue of the limited number of steps per layer of memory elements. The low number of steps results by having the storage elements separated by a resistive component as opposed to an active component. The 3-D array is in essence, an array of 2-D resistive arrays (row-planes) having a long dimension (typically along the rows) and a short dimension (typically in the direction of the stacked layers). Any one row-plane can be isolated from the rest and be accessed independently from all of the other row-planes in the 3-D array. This makes it possible to operate and analyze a single row-plane as a mostly stand-alone circuit. The present invention lends itself to single bit accesses as well as simultaneous multiple bit accesses.

Abstract: In various embodiments, a method for forming a memory array includes forming a plurality of rows and columns of hardmask material, etching holes in the one or more layers of insulating material using the combined masking properties of the rows of hardmask material and the columns of hardmask material, and forming memory cells in the holes. The corners of the holes can be rounded.

Abstract: In various embodiments, a method for forming a memory array includes forming a plurality of rows and columns of hardmask material, etching holes in the one or more layers of insulating material using the combined masking properties of the rows of hardmask material and the columns of hardmask material, and forming memory cells in the holes. The corners of the holes can be rounded.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: The present invention is a method for forming a vertically oriented element having a narrower area near its center away from either end. The present invention will find applicability in other memory cell structures. The element will have a narrow portion towards its center such that current density will be higher away from the ends of the element. In this way, the heating will occur away from the ends of the storage element. Heating in a phase-change or resistive change element leads to end of life conditions, including the condition whereby contaminants from the end point contacts are enabled to migrate away from the end point and into the storage element thereby contaminating the storage element material and reducing its ability to be programmed, erased and/or read back.

Abstract: A memory device includes a substrate, and, disposed thereover, an array of vertical memory switches. In some embodiments, each switch has at least three terminals and a cross-sectional area less than 6 F2.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: Methods of forming memory devices include providing a substrate, forming source, channel, and drain layers over the substrate, and patterning the source, channel, and drain layers into an array of memory switches each having a cross-sectional area less than 6 F2. The channel layer has a doping type different from a doping type of the source layer, and the drain layer has a doping type different from a doping type of the channel layer.

Abstract: A vertically oriented memory element having a narrower area near its center away from its ends is formed. Current density and heating are higher away from the ends of the memory element, thus increasing its lifetime.