Patents by Inventor Daniel Ray Ervin

Daniel Ray Ervin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic mating interface
    Patent number: 9613739
    Abstract: Methods and apparatus for automatically coupling stackable modular devices are described. The modular devices may be coupled using electromagnetic forces generated by precisely-timed pulses of electric current through electromagnetic materials that cause a first modular device to screw itself into a second modular device. The modular devices may exchange data through electrical or optical connections after coupling.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: April 4, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Zachary David Rattner, Clayton George Dumstorff, Daniel Ray Ervin, Robert Sean Daley
  • ELECTROMAGNETIC MATING INTERFACE
    Publication number: 20160180999
    Abstract: Methods and apparatus for automatically coupling stackable modular devices are described. The modular devices may be coupled using electromagnetic forces generated by precisely-timed pulses of electric current through electromagnetic materials that cause a first modular device to screw itself into a second modular device. The modular devices may exchange data through electrical or optical connections after coupling.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: Zachary David Rattner, Clayton George Dumstorff, Daniel Ray Ervin, Robert Sean Daley