Abstract: Methods, apparatuses and systems of manufacturing an optical fiber are disclosed herein. The methods may include heating an optical preform in a draw furnace, drawing an optical fiber from the optical preform, cooling the optical fiber with a slow cooling device, and annealing the optical fiber by passing the optical fiber through an RF plasma heating apparatus.

Abstract: A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.

Abstract: An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W?20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.

Abstract: A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.

Abstract: Methods, apparatuses and systems of manufacturing an optical fiber are disclosed herein. The methods may include heating an optical preform in a draw furnace, drawing an optical fiber from the optical preform, cooling the optical fiber with a slow cooling device, and annealing the optical fiber by passing the optical fiber through an RF plasma heating apparatus.

Abstract: An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W?20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.

Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A carrier apparatus including a base including a plurality of peripheral portions, each peripheral portion including an inner surface facing an inner direction, at least one peripheral portion selectively moveable between an extended position and a retracted position, and an elastic member to bias the at least one peripheral portion into the retracted position such that the inner surfaces of the peripheral portions of the plurality of peripheral portions cooperate to circumscribe a retaining area. The carrier apparatus may include an article disposed in the retaining area. A fixture including a cavity for receiving the carrier apparatus may be provided. Methods of using, processing, and assembling the carrier apparatus may also be provided.

Abstract: According to some embodiments method for making an optical fiber preform comprises the steps of: (i) placing a plurality of rods with an outer surface having a coefficient of friction 0.02?COF?0.3 into an inner cavity of an apparatus; (ii) placing particulate glass material in the inner cavity between the rods and an inner wall of the mold cavity; and (iii) applying pressure against the particulate glass material to press the particulate glass material against the plurality of rods.

Abstract: A carrier apparatus including a base including an outer peripheral surface and an inner support surface, a frame to connect to the outer peripheral surface of the base, and a circumferential flange including an outer circumferential portion and an inner circumferential portion. The outer circumferential portion to be clamped between the frame and the outer peripheral surface of the base, and the inner circumferential portion to extend inward from the frame. The inner circumferential portion including an opening to be spaced a distance from the inner support surface of the base. The carrier apparatus may include an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an edge extending across the thickness between the first major surface and the second major surface. Methods of processing and assembling the carrier apparatus may also be provided.

Abstract: A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m2 after the bonding step.

Abstract: An electrostatic chuck apparatus for chucking glass includes a substantially rigid chassis with a plurality of apertures extending from one side of the chassis to another side of the chassis. A plurality of electrostatic chuck pins extend through the openings and are resiliently mounted to the chassis such that the extent to which the electrostatic chuck pins extend through the chassis is individually variable. With this construction, the electrostatic chuck pins maintaining contact with the surface of the glass despite the presence of some variation in the localized surface flatness of the glass.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A electrostatic chucking apparatus and method for coating mobile device 2D or 3D cover glass in a vacuum coating chamber having a rotating drum and which is driven in rotation. The apparatus includes a carrier including a liquid-cooled cold plate which is removably mountable to the rotating drum. In the case of 3D cover glass, the carrier includes a portion with a 3D profile to match a 3D profile of the 3D cover glass. The carrier further includes an electrostatic chuck (ESC) adapted to secure the cover glass in place against the carrier in the face of centrifugal forces caused by rotation of the rotating drum, with the ESC developing a sufficient clamping force for reliably securing the cover glass in place.

Abstract: A chucking apparatus and method for vacuum processing mobile device cover substrates in a vacuum chamber in which the chucking apparatus is configured for temporarily securing the cover substrate within the vacuum chamber, and includes a carrier substrate with a CTE within 20% of CTE of the cover substrate to prevent the carrier substrate and the cover substrate from becoming detached from one another due to differing rates of thermal expansion during processing in the vacuum chamber. The carrier substrate has a surface contact area in contact with the cover substrate selected to provide for continuous bonding during the processing in the vacuum chamber and to provide for de-bonding after the process in the vacuum chamber is complete. Further, the carrier substrate is prepared for use with a cleaning process that facilitates Van der Waals bonding between the carrier substrate and the cover substrate.

Abstract: Disclosed herein are methods and apparatuses for adding thermal energy to a glass melt. Apparatuses for generating a thermal plasma disclosed herein comprise an electrode, a grounded electrode, a dielectric plasma confinement vessel extending between the two electrodes, and a magnetic field generator extending around the dielectric plasma confinement vessel. Also disclosed herein are methods for fining molten glass comprising generating a thermal plasma using the apparatuses disclosed herein and contacting the molten glass with the thermal plasma. Glass structures produced according to these methods are also disclosed herein.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: The disclosure relates to methods for making a ceramic or glass-ceramic, the methods comprising spray-drying a mixture comprising batch materials to form agglomerated particles; bringing the agglomerated particles into contact with a plasma for a residence time sufficient to form fused particles; and annealing the fused particles at a temperature and for a time sufficient to form ceramic or glass-ceramic particles. Fused glass particles, ceramic or glass-ceramic particles, and ceramic or glass-ceramic articles, such as ceramic honeycombs, made by these methods are also disclosed herein.

Abstract: The disclosure relates to methods for forming pre-melting and/or melting glass batch materials comprising bringing glass batch materials into contact with a plasma plume for a residence time sufficient to form substantially homogeneous, spheroid-shaped glass intermediate particles. The glass batch materials may flow in a cyclonic pattern in the plasma plume for increased residence time. The glass intermediate particles may be cooled with a tangential flow of gas to produce a cyclonic flow within the collection vessel. Also disclosed herein are glass intermediate particles comprising at least about 45 wt % of alumina and/or silica and less than about 55 wt % of at least one oxide of boron, V magnesium, calcium, sodium, strontium, tin, and/or titanium, wherein the glass intermediate particles are substantially homogenous and substantially spheroid in shape and have an average particle size ranging from about 5 to about 1,000 microns.