Patents by Inventor Daniel S. Jubin
Daniel S. Jubin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220278274Abstract: An electrical memristive device has a layer structure. The later structure comprises two electrodes and a bilayer material arrangement that connects the two electrodes. The bilayer material arrangement may, for example, be sandwiched by the two electrodes, in direct contact therewith. The bilayer material arrangement includes an HfOy layer, where 1.3±0.1?y<1.9±0.1, as well as a WOx layer in direct contact with the HfOy layer, where 2.5±0.1?x<2.9±0.1. The bilayer arrangement involves sub-stoichiometric layers of HfOy and WOx, where the WOx layer may advantageously have a polycrystalline structure in the monoclinic phase, while the HfOy layer is preferably amorphous.Type: ApplicationFiled: March 1, 2021Publication date: September 1, 2022Inventors: Bert Jan Offrein, Valeria Bragaglia, Folkert Horst, Antonio La Porta, Roger F. Dangel, Daniel S. Jubin
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Patent number: 9904016Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.Type: GrantFiled: February 22, 2017Date of Patent: February 27, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Jonas R. Weiss
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Patent number: 9791642Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: GrantFiled: February 20, 2017Date of Patent: October 17, 2017Assignee: International Business Machines CorporationInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9678273Abstract: A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.Type: GrantFiled: June 1, 2015Date of Patent: June 13, 2017Assignee: International Business Machines CorporationInventors: Jens Hofrichter, Daniel S. Jubin, Edward W. Kiewra, Antonio La Porta
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Publication number: 20170160480Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.Type: ApplicationFiled: February 22, 2017Publication date: June 8, 2017Inventors: ROGER F. DANGEL, DANIEL S. JUBIN, ANTONIO LA PORTA, JONAS R. WEISS
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Publication number: 20170160472Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: ApplicationFiled: February 20, 2017Publication date: June 8, 2017Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9671577Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: GrantFiled: September 9, 2015Date of Patent: June 6, 2017Assignee: International Business Machines CorporationInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9658400Abstract: A method of forming a device for propagating light includes providing a substrate having a semiconductor material; placing an insulating layer on the substrate; providing a recess reaching through the insulating layer and into the substrate; filling the recess at least partially with a filler material; and arranging a waveguide in or on the filler material.Type: GrantFiled: August 20, 2015Date of Patent: May 23, 2017Assignee: International Business Machines CorporationInventors: Jens Hofrichter, Daniel S. Jubin, Edward W. Kiewra, Antonio La Porta
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Publication number: 20170139134Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.Type: ApplicationFiled: November 16, 2015Publication date: May 18, 2017Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Jonas R. Weiss
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Patent number: 9632249Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.Type: GrantFiled: November 16, 2015Date of Patent: April 25, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Jonas R. Weiss
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Publication number: 20170068049Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: ApplicationFiled: September 9, 2015Publication date: March 9, 2017Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Publication number: 20170052318Abstract: A method of forming a device for propagating light includes providing a substrate having a semiconductor material; placing an insulating layer on the substrate; providing a recess reaching through the insulating layer and into the substrate; filling the recess at least partially with a filler material; and arranging a waveguide in or on the filler material.Type: ApplicationFiled: August 20, 2015Publication date: February 23, 2017Inventors: Jens Hofrichter, Daniel S. Jubin, Edward W. Kiewra, Antonio La Porta
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Publication number: 20160349452Abstract: A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.Type: ApplicationFiled: June 1, 2015Publication date: December 1, 2016Inventors: Jens Hofrichter, Daniel S. Jubin, Edward W. Kiewra, Antonio La Porta
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Patent number: 9310580Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.Type: GrantFiled: August 6, 2015Date of Patent: April 12, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Roger F. Dangel, Daniel S. Jubin, Tobias P. Lamprecht, Bert Jan Offrein
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Patent number: 9250393Abstract: Embodiments include methods for connecting a stack of waveguide layers to a face of a ferrule presenting a mechanical alignment structure. The method includes bringing a ferrule in an alignment position and dispersing glue in cavities of mechanical alignment structure for each waveguide layer. The method also includes sliding the waveguide layer into the cavities, inserting a comb-like tool in the ferrule so that the tool presses the waveguide layer into the cavities, glue curing the ferrule, and adding a cover to the ferrule. The mechanical alignment structure comprises mechanical alignment slots arranged in a bidirectional lattice structure.Type: GrantFiled: February 12, 2015Date of Patent: February 2, 2016Assignee: International Business Machines CorporationInventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Publication number: 20150346446Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.Type: ApplicationFiled: August 6, 2015Publication date: December 3, 2015Inventors: Roger F. Dangel, Daniel S. Jubin, Tobias P. Lamprecht, Bert Jan Offrein
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Patent number: 9170380Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: GrantFiled: February 12, 2015Date of Patent: October 27, 2015Assignee: International Business Machines CorporationInventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Patent number: 9110254Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.Type: GrantFiled: March 3, 2010Date of Patent: August 18, 2015Assignee: International Business Machines CorporationInventors: Roger F Dangel, Daniel S Jubin, Tobias P Lamprecht, Bert Jan Offrein
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Publication number: 20150219859Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: ApplicationFiled: February 12, 2015Publication date: August 6, 2015Inventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Publication number: 20150219862Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: ApplicationFiled: February 12, 2015Publication date: August 6, 2015Inventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein