Patents by Inventor Daniel S. Price

Daniel S. Price has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold and method for manufacturing a component by molding and component thereof thereof
    Publication number: 20240075658
    Abstract: The present invention relates to a mold for molding a component, in particular a particle foam part and a method for manufacturing the component using such a mold. In one embodiment, a mold for molding a component comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.
    Type: Application
    Filed: January 25, 2022
    Publication date: March 7, 2024
    Inventors: Jarkko SILTAMAEKI, Bastian GOTHE, Helge WEIGER, Andreas SEEFRIED, Maximilian DREXLER, Daniel S. PRICE, Dietmar K. DRUMMER, Kevin SCHNEIDER
  • MOLD AND METHOD FOR MANUFACTURING A COMPONENT BY MOLDING, COMPONENT THEREOF AND SHOE WITH SUCH A COMPONENT
    Publication number: 20220234256
    Abstract: The present invention relates to a mold for molding a component, in particular a piece of sports apparel, a method for manufacturing the component using such a mold and a shoe with such a component. In one embodiment, a mold for molding a component, in particular a piece of sports apparel, comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.
    Type: Application
    Filed: January 26, 2022
    Publication date: July 28, 2022
    Inventors: Jarkko Siltamäki, Bastian Gothe, Helge Weiger, Andreas Seefried, Maximilian Drexler, Kevin Schneider, Daniel S. Price, Dietmar K. Drummer
  • Heat sink clip mechanism
    Patent number: 7017653
    Abstract: A heat sink clip is provided for attaching a heat sink assembly to a universal retention module (URM). The heat sink clip includes a body and a lever attached to the body by way of a pin. The body of the heat sink clip includes engagement portions which engage posts of the URM. The lever of the heat sink clip is pivotally attached to the heat sink assembly. As the lever is pivoted from an open position to a closed position, the pin moves along a bearing surface of the body. Also as the lever is pivoted, the engagement portions of the body interact with the posts of the URM to secure the heat sink assembly to the URM.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 28, 2006
    Assignee: Molex Incorporated
    Inventors: Eric M. Lotter, Daniel S. Price