Abstract: Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass to both remove the plastic covering and bind particles having average nominal diameters of from 60 to 250 microns to the underlying substrate. In another use of the process the particles have an average nominal diameter of from 250 to 1400 microns and the use of a mask is optional because the particles can penetrate the plastic material and bind directly to the substrate. The process finds special use in forming electrical connections or solderable pads anywhere along the length of a flexible circuit.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract: A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate.

Abstract: A new kinetic spray process is disclosed that enables the coating to withstand severe bending and stress without delamination. The method includes use of a low pressure kinetic spray supersonic nozzle having a throat located between a converging region and a diverging region. A main gas temperature is raised to from 1000 to 1300 degrees Fahrenheit and the coating particles are directly injected into the diverging region of the nozzle at a point after the throat. The particles are entrained in the flow of the gas and accelerated to a velocity sufficient to result in partial melting of the particles upon impact on a substrate positioned opposite the nozzle and adherence of the particles to the substrate. The coating also has a desirable shinny surface. The method finds special application in coating substrates for use in formation of electrical connections.

Abstract: A new kinetic spray process is disclosed that enables the coating to withstand severe bending and stress without delamination. The method includes use of a low pressure kinetic spray supersonic nozzle having a throat located between a converging region and a diverging region. A main gas temperature is raised to from 1000 to 1300 degrees Fahrenheit and the coating particles are directly injected into the diverging region of the nozzle at a point after the throat. The particles are entrained in the flow of the gas and accelerated to a velocity sufficient to result in partial melting of the particles upon impact on a substrate positioned opposite the nozzle and adherence of the particles to the substrate. The coating also has a desirable shinny surface. The method finds special application in coating substrates for use in formation of electrical connections.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract: A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.