Abstract: Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.

Abstract: Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.

Abstract: A power generation system is disclosed. The power generation system includes an electrical converting device and a repowered portion connected to the electrical converting device. The repowered portion includes a reciprocating internal combustion engine and a gearbox. The reciprocating internal combustion engine is connected to the gearbox by a first connecting structure. The gearbox is connected to the electrical converting device by a second connecting structure.

Abstract: A power generation system is disclosed. The power generation system includes an electrical converting device and a repowered portion connected to the electrical converting device. The repowered portion includes a reciprocating internal combustion engine and a gearbox. The reciprocating internal combustion engine is connected to the gearbox by a first connecting structure. The gearbox is connected to the electrical converting device by a second connecting structure.

Abstract: A power generation system is disclosed. The power generation system includes an electrical converting device and a repowered portion connected to the electrical converting device. The repowered portion includes a reciprocating internal combustion engine and a gearbox. The reciprocating internal combustion engine is connected to the gearbox by a first connecting structure. The gearbox is connected to the electrical converting device by a second connecting structure.

Abstract: A power generation system is disclosed. The power generation system includes an electrical converting device and a repowered portion connected to the electrical converting device. The repowered portion includes a reciprocating internal combustion engine and a gearbox. The reciprocating internal combustion engine is connected to the gearbox by a first connecting structure. The gearbox is connected to the electrical converting device by a second connecting structure.

Abstract: A power generation system is disclosed. The power generation system includes an electrical converting device and a repowered portion connected to the electrical converting device. The repowered portion includes a reciprocating internal combustion engine and a gearbox. The reciprocating internal combustion engine is connected to the gearbox by a first connecting structure. The gearbox is connected to the electrical converting device by a second connecting structure.

Abstract: Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly.

Abstract: An anti-reflective coating for a substrate which includes an outer metal oxide layer with a refractive index greater than the refractive index of the substrate. The invention also relates to a method for making the anti-reflection coating.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.

Abstract: A method of making coated glass structure including providing a glass substrate wherein the glass substrate exhibits a color which is off neutral, and applying a coating to the glass substrate wherein the coating comprises a colorant capable of at least partially neutralizing the color. A glass structure including a glass substrate having a pair of major surfaces wherein the glass substrate exhibits a color which is off neutral, and a coating applied to at least one of the major surfaces wherein the coating exhibits a color which at least partially neutralizes the color of the glass substrate.

Abstract: Reactors with agitators and methods for processing microfeature workpieces with such reactors. The agitators are capable of obtaining high, controlled mass-transfer rates that result in high quality surfaces and efficient wet chemical processes. The agitators generate high flow velocities in the fluid and contain the high energy fluid proximate to the surface of the workpiece to form high quality surfaces when cleaning, etching and/or depositing materials to/from a workpiece. The agitators also have short stroke lengths so that the footprints of the reactors are relatively small. As a result, the reactors are efficient and cost effective to operate. The agitators are also designed so that electrical fields in the processing solution can effectively operate at the surface of the workpiece.

Abstract: Systems and methods for processing microfeature workpieces with agitators are disclosed. A system in accordance with one embodiment includes a vessel configured to receive a processing fluid at a process location, a fluid inlet positioned to direct the processing fluid into the vessel, a weir positioned above the process location and outwardly from the fluid inlet to receive the processing fluid moving radially outwardly from the inlet, and a workpiece support positioned to carry a workpiece at the process location. An agitator has an elongated agitator element positioned proximate to the process location, a first support proximate to a first end of the agitator element, and a second support proximate to an opposite end of the agitator element. A motor is coupled to the first support and not the second support to drive the agitator along a linear path relative to the process location. A linear guide is engaged with the second support to guide the motion of the agitator.

Abstract: In a workpiece process end point detection system, light is diffused and then light intensity or color is sensed. Optical noise is greatly reduced and more accurate end point detection can be made. A light emitter and a light sensor may be located within a workpiece process chamber. A housing around the light emitter and the light sensor seals out process fluids and also diffuses light passing through. The diffused light may be optically filtered before reaching the light sensor.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.

Abstract: End-effectors and associated control and guidance systems and methods are disclosed. A transfer device in one embodiment includes a base unit, an arm carried by the base unit and movable relative to the base unit, and an end-effector carried by the arm and rotatable relative to the arm. The end-effector includes two grippers, at least one being movable toward and away from the other between a grip position and a release position. A transmission is coupled between a motor and the movable gripper to receive an input force from the motor and apply an output force to the gripper that increases as the gripper moves to the grip position.

Abstract: An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting the mounting module to a load/unload module, and a rear docking unit with rear alignment elements for connecting the mounting module to a main processing unit. The mounting module can further include a deck between the front docking unit and the rear docking unit, positioning elements at the deck, and attachment elements at the deck. The first device can be a processing chamber, an annealing station, a metrology station, a buffer station, or another type of component for holding or otherwise performing a function on a workpiece.

Abstract: A workpiece support apparatus for use in a process vessel and process system for treating semiconductor workpieces. The process vessel is to be utilized in an integrated tool for wet chemical treatment of a semiconductor workpiece. The workpiece support apparatus includes a rotor having a central cavity and guide pins mounted at an outer perimeter. A workpiece support having extendable workpiece support fingers is connected to the rotor. The extendable workpiece support fingers are moveable from a first position to a second position. A bellows seal connects the workpiece support to the rotor. A fluid delivery tube is positioned in the central cavity of the rotor and connected to a supply of fluid.

Abstract: The present invention provides a semiconductor workpiece support and contact assembly for providing localized electrical connections with the device side of the workpiece. The additional contact points help overcome the terminal effect caused by very high sheet resistance of thin barrier layers and enable plating a conformal seed layer or feature filling directly on thin barrier layers. By utilizing the streets that separate individual dice on a workpiece to make electrical connections with the workpiece and provide localized distribution of plating chemistry, the present invention provides a more uniform and conformal metallization layer.