Patents by Inventor Daniela Morin

Daniela Morin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for bonding and electrically connecting microsystems integrated in several distinct substrates
    Patent number: 7595223
    Abstract: A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: September 29, 2009
    Assignees: STMicroelectronics S.r.l., Hewlett-Packard Company
    Inventors: Ubaldo Mastromatteo, Mauro Bombonati, Daniela Morin, Marta Mottura, Mauro Marchi
  • PROCESS FOR BONDING AND ELECTRICALLY CONNECTING MICROSYSTEMS INTEGRATED IN SEVERAL DISTINCT SUBSTRATES
    Publication number: 20070254454
    Abstract: A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
    Type: Application
    Filed: June 21, 2007
    Publication date: November 1, 2007
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Ubaldo Mastromatteo, Mauro Bombonati, Daniela Morin, Marta Mottura, Mauro Marchi
  • Process for bonding and electrically connecting microsystems integrated in several distinct substrates
    Publication number: 20030109183
    Abstract: A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
    Type: Application
    Filed: September 12, 2002
    Publication date: June 12, 2003
    Applicants: STMicroelectronics S.r.I., Hewlett-Packard Company
    Inventors: Ubaldo Mastromatteo, Mauro Bombonati, Daniela Morin, Marta Mottura, Mauro Marchi