Patents by Inventor Danli Wang
Danli Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11713278Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: GrantFiled: January 6, 2021Date of Patent: August 1, 2023Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Patent number: 11618712Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.Type: GrantFiled: February 15, 2022Date of Patent: April 4, 2023Assignee: 3M Innovative Properties CompanyInventor: DanLi Wang
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Publication number: 20220169568Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Inventor: DanLi Wang
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Patent number: 11267758Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.Type: GrantFiled: August 22, 2018Date of Patent: March 8, 2022Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventor: DanLi Wang
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Patent number: 11202797Abstract: The present invention discloses a mixture of fucosylated chondroitin sulfate oligosaccharides having an average molecular weight between 2700 Da and 3600 Da, in which 90% of total components has a molecular weight between 1800 Da and 5400 Da. The mixture of fucosylated chondroitin sulfate oligosaccharide of the present invention has very low anti-FIIa factor activity, very low anti-FXa factor activity, very high anti-FXase factor activity, i.e., having a significant activity in selectively inhibiting intrinsic FXase, and a significant antithrombotic activity and no risk of bleeding and hypotension that are proved through animal experiments. The present invention also discloses a method for rapidly producing fucosylated chondroitin sulfate oligosaccharides by using sea cucumber as raw material, and the method includes: intercepting and concentrating crude polysaccharide with a membrane, deacetylation with hydrazine, pyrolysis with nitrous acid, reduction with sodium borohydride, membrane separation, etc.Type: GrantFiled: July 11, 2018Date of Patent: December 21, 2021Assignee: ZHEJIANG UNIVERSITYInventors: Shiguo Chen, Lufeng Yan, Danli Wang, Junhui Li, Xingqian Ye, Donghong Liu
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Publication number: 20210147294Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: ApplicationFiled: January 6, 2021Publication date: May 20, 2021Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Patent number: 10918618Abstract: Methods of delaying the onset of an infection or preventing an infection caused by a microbial organism in an internal cavity of a subject are provided. Methods of killing or inactivating microorganisms in at least a portion of the urethra of a subject are provided.Type: GrantFiled: March 10, 2006Date of Patent: February 16, 2021Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Matthew T. Scholz, Terry R. Hobbs, Danli Wang
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Patent number: 10894742Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: GrantFiled: April 4, 2019Date of Patent: January 19, 2021Assignee: 3M Innovative Properties CompanyInventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Publication number: 20200290927Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.Type: ApplicationFiled: August 22, 2018Publication date: September 17, 2020Inventor: DanLi Wang
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Publication number: 20200261493Abstract: The present invention discloses a mixture of fucosylated chondroitin sulfate oligosaccharides having an average molecular weight between 2700 Da and 3600 Da, in which 90% of total components has a molecular weight between 1800 Da and 5400 Da. The mixture of fucosylated chondroitin sulfate oligosaccharide of the present invention has very low anti-FIIa factor activity, very low anti-FXa factor activity, very high anti-FXase factor activity, i.e., having a significant activity in selectively inhibiting intrinsic FXase, and a significant antithrombotic activity and no risk of bleeding and hypotension that are proved through animal experiments. The present invention also discloses a method for rapidly producing fucosylated chondroitin sulfate oligosaccharides by using sea cucumber as raw material, and the method includes: intercepting and concentrating crude polysaccharide with a membrane, deacetylation with hydrazine, pyrolysis with nitrous acid, reduction with sodium borohydride, membrane separation, etc.Type: ApplicationFiled: July 11, 2018Publication date: August 20, 2020Inventors: Shiguo CHEN, Lufeng YAN, Danli WANG, Junhui LI, Xingqian YE, Donghong LIU
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Publication number: 20190225543Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: ApplicationFiled: April 4, 2019Publication date: July 25, 2019Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Patent number: 10323161Abstract: The present disclosure is directed to compositions and methods for coating, particularly protecting and optionally cleaning, metallic surfaces, and articles containing such surfaces.Type: GrantFiled: September 11, 2015Date of Patent: June 18, 2019Assignee: 3M Innovative Properties CompanyInventors: Justin A. Riddle, Adam J. Meuler, DanLi Wang, Zachary J. Malmberg, Syud M. Ahmed, Paul B. Armstrong, Milind B. Sabade
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Patent number: 10273185Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: GrantFiled: June 10, 2015Date of Patent: April 30, 2019Assignee: 3M Innovative Properties CompanyInventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Patent number: 10081954Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.Type: GrantFiled: November 17, 2017Date of Patent: September 25, 2018Assignee: 3M Innovative Properties CompanyInventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
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Publication number: 20180207122Abstract: Methods of delaying the onset of an infection or preventing an infection caused by a microbial organism in an internal cavity of a subject are provided. Methods of killing or inactivating microorganisms in at least a portion of the urethra of a subject are provided.Type: ApplicationFiled: March 20, 2018Publication date: July 26, 2018Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Matthew T. Scholz, Terry R. Hobbs, DanLi Wang
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Publication number: 20180179109Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.Type: ApplicationFiled: June 10, 2015Publication date: June 28, 2018Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
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Publication number: 20180094446Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.Type: ApplicationFiled: November 17, 2017Publication date: April 5, 2018Inventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
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Patent number: 9826770Abstract: Antimicrobial compositions, especially those useful when applied topically, particularly to mucosal tissues (i.e., mucous membranes), including, in particular, a fatty alcohol ester of a hydroxycarboxylic acid, alkoxylated derivatives thereof, or combinations thereof. The compositions can also include an enhancer component, a surfactant component, a hydrophobic component, and/or a hydrophilic component. Such compositions provide effective topical antimicrobial activity and are accordingly useful in the treatment and/or prevention of conditions that are caused, or aggravated by, microorganisms (including viruses).Type: GrantFiled: March 10, 2006Date of Patent: November 28, 2017Assignee: 3M Innovative Properties CompanyInventors: Matthew T. Scholz, Danli Wang
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Patent number: 9828782Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.Type: GrantFiled: June 10, 2015Date of Patent: November 28, 2017Assignee: 3M Innovative Properties CompanyInventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
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Patent number: D953639Type: GrantFiled: May 25, 2020Date of Patent: May 31, 2022Assignee: Shenzhen Chuangpin Intelligent Electric Co., LtdInventor: Danli Wang