Patents by Inventor Danli Wang

Danli Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11713278
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: August 1, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Patent number: 11618712
    Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: April 4, 2023
    Assignee: 3M Innovative Properties Company
    Inventor: DanLi Wang
  • Publication number: 20220169568
    Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Inventor: DanLi Wang
  • Patent number: 11267758
    Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 8, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: DanLi Wang
  • Patent number: 11202797
    Abstract: The present invention discloses a mixture of fucosylated chondroitin sulfate oligosaccharides having an average molecular weight between 2700 Da and 3600 Da, in which 90% of total components has a molecular weight between 1800 Da and 5400 Da. The mixture of fucosylated chondroitin sulfate oligosaccharide of the present invention has very low anti-FIIa factor activity, very low anti-FXa factor activity, very high anti-FXase factor activity, i.e., having a significant activity in selectively inhibiting intrinsic FXase, and a significant antithrombotic activity and no risk of bleeding and hypotension that are proved through animal experiments. The present invention also discloses a method for rapidly producing fucosylated chondroitin sulfate oligosaccharides by using sea cucumber as raw material, and the method includes: intercepting and concentrating crude polysaccharide with a membrane, deacetylation with hydrazine, pyrolysis with nitrous acid, reduction with sodium borohydride, membrane separation, etc.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: December 21, 2021
    Assignee: ZHEJIANG UNIVERSITY
    Inventors: Shiguo Chen, Lufeng Yan, Danli Wang, Junhui Li, Xingqian Ye, Donghong Liu
  • Publication number: 20210147294
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Application
    Filed: January 6, 2021
    Publication date: May 20, 2021
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Patent number: 10918618
    Abstract: Methods of delaying the onset of an infection or preventing an infection caused by a microbial organism in an internal cavity of a subject are provided. Methods of killing or inactivating microorganisms in at least a portion of the urethra of a subject are provided.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: February 16, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew T. Scholz, Terry R. Hobbs, Danli Wang
  • Patent number: 10894742
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: January 19, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Publication number: 20200290927
    Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.
    Type: Application
    Filed: August 22, 2018
    Publication date: September 17, 2020
    Inventor: DanLi Wang
  • Publication number: 20200261493
    Abstract: The present invention discloses a mixture of fucosylated chondroitin sulfate oligosaccharides having an average molecular weight between 2700 Da and 3600 Da, in which 90% of total components has a molecular weight between 1800 Da and 5400 Da. The mixture of fucosylated chondroitin sulfate oligosaccharide of the present invention has very low anti-FIIa factor activity, very low anti-FXa factor activity, very high anti-FXase factor activity, i.e., having a significant activity in selectively inhibiting intrinsic FXase, and a significant antithrombotic activity and no risk of bleeding and hypotension that are proved through animal experiments. The present invention also discloses a method for rapidly producing fucosylated chondroitin sulfate oligosaccharides by using sea cucumber as raw material, and the method includes: intercepting and concentrating crude polysaccharide with a membrane, deacetylation with hydrazine, pyrolysis with nitrous acid, reduction with sodium borohydride, membrane separation, etc.
    Type: Application
    Filed: July 11, 2018
    Publication date: August 20, 2020
    Inventors: Shiguo CHEN, Lufeng YAN, Danli WANG, Junhui LI, Xingqian YE, Donghong LIU
  • Publication number: 20190225543
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Application
    Filed: April 4, 2019
    Publication date: July 25, 2019
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Patent number: 10323161
    Abstract: The present disclosure is directed to compositions and methods for coating, particularly protecting and optionally cleaning, metallic surfaces, and articles containing such surfaces.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: June 18, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Justin A. Riddle, Adam J. Meuler, DanLi Wang, Zachary J. Malmberg, Syud M. Ahmed, Paul B. Armstrong, Milind B. Sabade
  • Patent number: 10273185
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: April 30, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Patent number: 10081954
    Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: September 25, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
  • Publication number: 20180207122
    Abstract: Methods of delaying the onset of an infection or preventing an infection caused by a microbial organism in an internal cavity of a subject are provided. Methods of killing or inactivating microorganisms in at least a portion of the urethra of a subject are provided.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 26, 2018
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew T. Scholz, Terry R. Hobbs, DanLi Wang
  • Publication number: 20180179109
    Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
    Type: Application
    Filed: June 10, 2015
    Publication date: June 28, 2018
    Inventors: John E. Gozum, DanLi Wang, Dwight B. Schoenherr
  • Publication number: 20180094446
    Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.
    Type: Application
    Filed: November 17, 2017
    Publication date: April 5, 2018
    Inventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
  • Patent number: 9826770
    Abstract: Antimicrobial compositions, especially those useful when applied topically, particularly to mucosal tissues (i.e., mucous membranes), including, in particular, a fatty alcohol ester of a hydroxycarboxylic acid, alkoxylated derivatives thereof, or combinations thereof. The compositions can also include an enhancer component, a surfactant component, a hydrophobic component, and/or a hydrophilic component. Such compositions provide effective topical antimicrobial activity and are accordingly useful in the treatment and/or prevention of conditions that are caused, or aggravated by, microorganisms (including viruses).
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: November 28, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew T. Scholz, Danli Wang
  • Patent number: 9828782
    Abstract: A backing device useful in repairing a hole. In some embodiments, the hole is in a wall, for example a relatively large hole in a wall (e.g., vertical wall, ceiling, etc.) of, for example, a home or building structure. The backing device includes a collapsible backing member and adhesive strips. The backing member defines a front face opposite a rear face, and includes first and second panels connected at a hinge segment. The adhesive strips are disposed on the front face. The backing member is foldable from a flat state to a collapsed state for insertion through the wall hole. Once deployed “behind” the wall, the backing member is transitioned to the flat state, and the adhesive strips utilized to secure the backing device to a back surface of the wall. In some embodiments, the backing device, while in the flat state, is relatively rigid in one direction and collapsible in the opposite direction.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: November 28, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: DanLi Wang, Michael E. Kuhl, Dwight B. Schoenherr, Judd D. Olson
  • Patent number: D953639
    Type: Grant
    Filed: May 25, 2020
    Date of Patent: May 31, 2022
    Assignee: Shenzhen Chuangpin Intelligent Electric Co., Ltd
    Inventor: Danli Wang