Patents by Inventor Danny Lu
Danny Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120138472Abstract: Methods of fabricating a chamber component capable of being exposed to a plasma in a process chamber includes: providing a component structure composed of metal; immersing the surface of the component structure in an electroplating bath comprising first metal electrolyte species and second metal electrolyte species; forming a cathode by connecting the component structure to a negative terminal of a voltage source; immersing in the electroplating bath, an anode comprising an inert material or material to be electroplated, and connecting the anode to a positive terminal of the voltage source; and electroplating a layer having a concentration gradient of the first metal, second metal, or both.Type: ApplicationFiled: February 13, 2012Publication date: June 7, 2012Inventors: Nianci HAN, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Patent number: 8114525Abstract: A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.Type: GrantFiled: May 8, 2008Date of Patent: February 14, 2012Assignee: Applied Materials, Inc.Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Patent number: 7833401Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.Type: GrantFiled: June 21, 2007Date of Patent: November 16, 2010Assignee: Applied Materials, Inc.Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Publication number: 20080223725Abstract: A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.Type: ApplicationFiled: May 8, 2008Publication date: September 18, 2008Applicant: Applied Materials, Inc.Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Patent number: 7371467Abstract: A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.Type: GrantFiled: April 13, 2004Date of Patent: May 13, 2008Assignee: Applied Materials, Inc.Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Publication number: 20080017516Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.Type: ApplicationFiled: June 21, 2007Publication date: January 24, 2008Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Sun
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Publication number: 20040191545Abstract: A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.Type: ApplicationFiled: April 13, 2004Publication date: September 30, 2004Applicant: Applied Materials, Inc.Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
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Patent number: 6641697Abstract: An erosion resistant member that may be used in the processing of a substrate in a plasma of a processing gas, comprises at least a portion that may be exposed to the plasma of the processing gas and that contains more than about 3% by weight of an oxide of a Group IIIB metal. The portion may also further contain a ceramic compound selected from silicon carbide, silicon nitride, boron carbide, boron nitride, aluminum nitride, aluminum oxide, and mixtures thereof.Type: GrantFiled: October 24, 2001Date of Patent: November 4, 2003Assignee: Applied Materials, IncInventors: Nianci Han, Hong Shih, Jie Yuan, Danny Lu, Diana Ma
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Publication number: 20020100554Abstract: An erosion resistant member that may be used in the processing of a substrate in a plasma of a processing gas, comprises at least a portion that may be exposed to the plasma of the processing gas and that contains more than about 3% by weight of an oxide of a Group IIIB metal. The portion may also further contain a ceramic compound selected from silicon carbide, silicon nitride, boron carbide, boron nitride, aluminum nitride, aluminum oxide, and mixtures thereof.Type: ApplicationFiled: October 24, 2001Publication date: August 1, 2002Applicant: Applied Materials, Inc.Inventors: Nianci Han, Hong Shih, Jie Yuan, Danny Lu, Diana Ma
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Patent number: 6413389Abstract: A method and assembly for recovering a metal from by-products produced from etching a metal (e.g., platinum, iridium, aluminum, etc.) in a plasma processing chamber. The method includes recovering from the plasma processing chamber a deposit of the by-products containing the metal. The deposit is dissolved in an acid, and the metal is recovered from the acid by inserting a working electrode, a reference electrode, and a counter electrode into the acid and applying a difference in potential between the working and reference electrodes to cause current to flow through the working and counter electrodes and the metal to be removed from the liquid and deposit on the working electrode. The metal is removed from the working electrode to recover the metal.Type: GrantFiled: December 17, 1999Date of Patent: July 2, 2002Assignee: Applied Materials, Inc.Inventors: Hong Shih, Danny Lu, Nianci Han, Li Xu, Diana Ma
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Patent number: 6352611Abstract: A ceramic composition of matter for a process kit and a dielectric window of a reactor chamber wherein substrates are processed in a plasma of a processing gas. The ceramic composition of matter contains a ceramic compound (e.g. Al2O3) and an oxide of a Group IIIB metal (e.g., Y2O3). A method for processing (e.g. etching) a substrate in a chamber containing a plasma of a processing gas. The method includes passing processing power through a dielectric window which is formed from the ceramic composition of matter.Type: GrantFiled: June 2, 2000Date of Patent: March 5, 2002Assignee: Applied Materials, Inc.Inventors: Nianci Han, Hong Shih, Jie Yuan, Danny Lu, Diana Ma
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Patent number: 6123791Abstract: A ceramic composition of matter for a process kit and a dielectric window of a reactor chamber wherein substrates are processed in a plasma of a processing gas. The ceramic composition of matter contains a ceramic compound (e.g. Al.sub.2 O.sub.3) and an oxide of a Group IIIB metal (e.g., Y.sub.2 O.sub.3). A method for processing (e.g. etching) a substrate in a chamber containing a plasma of a processing gas. The method includes passing processing power through a dielectric window which is formed from the ceramic composition of matter.Type: GrantFiled: July 29, 1998Date of Patent: September 26, 2000Assignee: Applied Materials, Inc.Inventors: Nianci Han, Hong Shih, Jie Yuan, Danny Lu, Diana Ma