Abstract: A wire harness for a vehicle digital dashboard retrofit conversion for a vehicle manufacturer is provided. The wire harness includes a rectangular housing body having a hollow interior forming a perimeter surface. The rectangular housing has a number of pins positioned within the housing. A number of preconnected wires electrically connected to the number of pins is provided, and the hollow interior of the rectangular housing body is sized and shaped to accept a male OEM connector for receiving gauge signals, such that a number of leads provided on the male OEM connector electrically connect to the number of pins. The number of preconnected wires are configured to electrically connect to a digital dashboard directly or indirectly such that the vehicle may be retrofitted with the digital dashboard.

Abstract: In one general aspect, an apparatus can include an energy storage device configured to store energy during an unclamped inductive switching test of a target device, and a switch device configured to shunt at least a portion of energy away from the target device in response to the target device changing from a breakdown state to a failure state.

Abstract: An apparatus comprises a wire bonder system including a wire bonding device, a measuring device and a rejection device. The wire bonding device is configured to attach wire bond type electrical interconnect to an electronic assembly. A wire bond is formed between a first semiconductor device and a second electronic device to form at least a portion of the electronic assembly. The measuring device is configured to perform a three dimensional measurement associated with a wire bond, and the rejection device is configured to identify an electronic assembly for rejection according to the three dimensional wire bond measurement.

Abstract: In one general aspect, an apparatus can include an energy storage device configured to store energy during an unclamped inductive switching test of a target device, and a switch device configured to shunt at least a portion of energy away from the target device in response to the target device changing from a breakdown state to a failure state.