Patents by Inventor Darin Heisterkamp

Darin Heisterkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER PASTE ON DEMAND APPARATUS
    Publication number: 20230278145
    Abstract: A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.
    Type: Application
    Filed: March 17, 2023
    Publication date: September 7, 2023
    Inventors: Martin Thuo, Ian Tevis, Darin Heisterkamp
  • Solder paste on demand apparatus
    Patent number: 11633702
    Abstract: A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: April 25, 2023
    Assignee: SAFI-TECH, INC.
    Inventors: Martin Thuo, Ian Tevis, Darin Heisterkamp
  • SOLDER PASTE ON DEMAND APPARATUS
    Publication number: 20230012401
    Abstract: A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 12, 2023
    Inventors: Martin Thuo, Ian Tevis, Darin Heisterkamp